Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058765/0219 | |
| Pages: | 4 |
| | Recorded: | 01/25/2022 | | |
| Attorney Dkt #: | 20901-153848-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17630061
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Filing Dt:
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01/25/2022
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Publication #:
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Pub Dt:
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09/01/2022
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Title:
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PREFORMED SOLDER AND SOLDER BONDED BODY FORMED BY USING SAID PREFORMED SOLDER
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Assignee
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| 1-16-15, ESAKACHO, SUITA-SHI |
| OSAKA, JAPAN 5640063 |
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Correspondence name and address
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FITCH EVEN TABIN & FLANNERY, LLP
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120 SOUTH LASALLE STREET
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SUITE 2100
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CHICAGO, 60603-3406 UNITED STATES
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