Patent Assignment Details
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| Reel/Frame: | 058814/0454 | |
| Pages: | 9 |
| | Recorded: | 01/28/2022 | | |
| Attorney Dkt #: | 20277-153039-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17421668
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Filing Dt:
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07/08/2021
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Publication #:
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Pub Dt:
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03/24/2022
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Title:
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COMPOSITION FOR FILM FORMATION, RESIST COMPOSITION, RADIATION-SENSITIVE COMPOSITION, METHOD FOR PRODUCING AMORPHOUS FILM, RESIST PATTERN FORMATION METHOD, COMPOSITION FOR UNDERLAYER FILM FORMATION FOR LITHOGRAPHY, METHOD FOR PRODUCING UNDERLAYER FILM FOR LITHOGRAPHY, AND CIRCUIT PATTERN FORMATION METHOD
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Assignee
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| 5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8324 |
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Correspondence name and address
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FITCH EVEN TABIN & FLANNERY, LLP
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120 SOUTH LASALLE STREET
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SUITE 2100
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CHICAGO, IL 60603-3406
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