Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 058846/0331 | |
| Pages: | 10 |
| | Recorded: | 02/01/2022 | | |
| Attorney Dkt #: | TSMCP585USD |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/06/2024
|
Application #:
|
17590224
|
Filing Dt:
|
02/01/2022
|
|
Publication #:
|
|
Pub Dt:
|
05/19/2022
| | | | |
|
Title:
|
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
|
|
|
Assignee
|
|
|
|
|
| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
|
|
Correspondence name and address
|
| |
ESCHWEILER & POTASHNIK, LLC
|
| |
629 EUCLID AVE.
|
| |
SUITE 1101
|
| |
CLEVELAND, OH 44114
|
Search Results as of:
05/01/2024 08:48 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
