Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058864/0879 | |
| Pages: | 4 |
| | Recorded: | 11/12/2021 | | |
| Attorney Dkt #: | 2021-0732A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/16/2024
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Application #:
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17610876
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Filing Dt:
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11/12/2021
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Publication #:
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Pub Dt:
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07/07/2022
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Title:
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CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELECTRODE
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Assignee
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 1208555 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK L.L.P
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1025 CONNECTICUT AVENUE NW
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SUITE 500
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WASHINGTON, DC 20036
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