Patent Assignment Details
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Reel/Frame: | 058917/0844 | |
| Pages: | 9 |
| | Recorded: | 02/08/2022 | | |
Attorney Dkt #: | YKN-0017NCC |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17633598
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Filing Dt:
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02/08/2022
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Publication #:
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Pub Dt:
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09/29/2022
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Title:
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MULTI-LAYER SHEET FOR MOLD UNDERFILL ENCAPSULATION, METHOD FOR MOLD UNDERFILL ENCAPSULATION, ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT
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Assignee
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1-17, SHINMACHI 1-CHOME, NISHI-KU, OSAKA-SHI |
OSAKA, JAPAN 5508668 |
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Correspondence name and address
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IMAIZUMI IP LAW, PLLC
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4601 NORTH FAIRFAX DRIVE
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SUITE 1200
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ARLINGTON, VA 22203
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