Patent Assignment Details
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| Reel/Frame: | 058977/0081 | |
| Pages: | 5 |
| | Recorded: | 02/10/2022 | | |
| Attorney Dkt #: | 5006.0069US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/12/2024
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Application #:
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17666790
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Filing Dt:
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02/08/2022
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Publication #:
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Pub Dt:
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08/11/2022
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Title:
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SEMICONDUCTOR APPARATUS WITH HEAT DISSIPATION CONDUIT IN SIDEWALL INTERCONNECTION STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
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Assignee
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| NO.3 BEITUCHENG WEST ROAD, CHAOYANG DISTRICT |
| BEIJING, CHINA 100029 |
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Correspondence name and address
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JOHN P. FONDER
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11322 86TH AVENUE NORTH
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MAPLE GROVE, MN 55369
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05/20/2024 09:22 AM
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