Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058998/0281 | |
| Pages: | 5 |
| | Recorded: | 02/14/2022 | | |
| Attorney Dkt #: | GF2021272-US-NP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/16/2023
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Application #:
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17650845
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Filing Dt:
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02/12/2022
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Title:
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PIC DIE AND PACKAGE WITH COVER FOR MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTIONS OF FIBERS TO ON-CHIP OPTICAL COMPONENTS
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Assignee
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| 400 STONEBREAK ROAD EXTENSION |
| MALTA, NEW YORK 12020 |
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Correspondence name and address
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HOFFMAN WARNICK LLC
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540 BROADWAY
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4TH FLOOR
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ALBANY, NY 12207
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05/22/2024 01:59 PM
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