Patent Assignment Details
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| Reel/Frame: | 059084/0055 | |
| Pages: | 4 |
| | Recorded: | 02/24/2022 | | |
| Attorney Dkt #: | 21P0329 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17753215
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Filing Dt:
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02/24/2022
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Publication #:
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Pub Dt:
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09/22/2022
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Title:
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HEAT SINK, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE
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Assignees
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| 2-3, KAMIOSE-CHO, HIGASHI-KU, |
| NIIGATA-SHI, NIIGATA, JAPAN 9500063 |
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| 2-3, UCHISAIWAI-CHO 2-CHOME, |
| CHIYODA-KU, TOKYO, JAPAN 1000011 |
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Correspondence name and address
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KENJA IP LAW PC
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4 NORTH SECOND STREET, SUITE 598
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SAN JOSE, CA 95113
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04/28/2024 02:41 PM
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