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Reel/Frame:059207/0404   Pages: 10
Recorded: 03/09/2022
Attorney Dkt #:20369-154039-US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17640735
Filing Dt:
03/04/2022
Publication #:
Pub Dt:
10/20/2022
Title:
POLYAMIDEIMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE
Assignors
1
Exec Dt:
09/01/2021
2
Exec Dt:
09/02/2021
3
Exec Dt:
09/02/2021
4
Exec Dt:
09/02/2021
Assignee
1
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-6606
Correspondence name and address
FITCH, EVEN, TABIN & FLANNERY, LLP
120 SOUTH LASALLE STREET, SUITE 2100
CHICAGO, IL 60603-3406

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