Patent Assignment Details
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| Reel/Frame: | 059546/0659 | |
| Pages: | 12 |
| | Recorded: | 03/30/2022 | | |
| Attorney Dkt #: | 249/1354_00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17708323
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Filing Dt:
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03/30/2022
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Publication #:
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Pub Dt:
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10/13/2022
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Title:
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ORGANOMETALLIC ADDUCT COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME
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Assignees
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| 2-35, HIGASHIOGU 7-CHOME, ARAKAWA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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EUGENE M LEE
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LEE IP LAW, P.C.
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3141 FAIRVIEW PARK DRIVE, SUITE 500
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FALLS CHURCH, VA 22042
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