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Reel/Frame:	059581/0435			Pages:	8
		Recorded:	04/04/2022
Attorney Dkt #:	001443
Conveyance:	CERTIFICATE OF CONVERSION & CHANGE OF NAME

Total properties: 65

Patent #:	NONE	Issue Dt:		Application #:	14027571	Filing Dt:	09/16/2013
Publication #:	US20150076714	Pub Dt:	03/19/2015
Title:	MICROELECTRONIC ELEMENT WITH BOND ELEMENTS TO ENCAPSULATION SURFACE

Patent #:	9583426	Issue Dt:	02/28/2017	Application #:	14533728	Filing Dt:	11/05/2014
Publication #:	US20160126174	Pub Dt:	05/05/2016
Title:	MULTI-LAYER SUBSTRATES SUITABLE FOR INTERCONNECTION BETWEEN CIRCUIT MODULES

Patent #:	9666559	Issue Dt:	05/30/2017	Application #:	14809036	Filing Dt:	07/24/2015
Publication #:	US20160071818	Pub Dt:	03/10/2016
Title:	MULTICHIP MODULES AND METHODS OF FABRICATION

Patent #:	9490222	Issue Dt:	11/08/2016	Application #:	14880967	Filing Dt:	10/12/2015
Title:	WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Patent #:	9484080	Issue Dt:	11/01/2016	Application #:	14935705	Filing Dt:	11/09/2015
Title:	High-Bandwidth Memory Application With Controlled Impedance Loading

Patent #:	9899442	Issue Dt:	02/20/2018	Application #:	14945292	Filing Dt:	11/18/2015
Publication #:	US20160172402	Pub Dt:	06/16/2016
Title:	IMAGE SENSOR DEVICE

Patent #:	10490528	Issue Dt:	11/26/2019	Application #:	14993586	Filing Dt:	01/12/2016
Publication #:	US20170103968	Pub Dt:	04/13/2017
Title:	Embedded wire bond wires

Patent #:	9984992	Issue Dt:	05/29/2018	Application #:	14997774	Filing Dt:	01/18/2016
Publication #:	US20170194281	Pub Dt:	07/06/2017
Title:	Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces

Patent #:	9812185	Issue Dt:	11/07/2017	Application #:	15019788	Filing Dt:	02/09/2016
Publication #:	US20170117030	Pub Dt:	04/27/2017
Title:	DRAM Adjacent Row Disturb Mitigation

Patent #:	10636767	Issue Dt:	04/28/2020	Application #:	15057083	Filing Dt:	02/29/2016
Publication #:	US20170250161	Pub Dt:	08/31/2017
Title:	Correction Die for Wafer/Die Stack

Patent #:	10304803	Issue Dt:	05/28/2019	Application #:	15147807	Filing Dt:	05/05/2016
Publication #:	US20170323867	Pub Dt:	11/09/2017
Title:	Nanoscale Interconnect Array for Stacked Dies

Patent #:	NONE	Issue Dt:		Application #:	15152469	Filing Dt:	05/11/2016
Publication #:	US20170186730	Pub Dt:	06/29/2017
Title:	SYSTEM AND METHOD FOR PROVIDING 3D WAFER ASSEMBLY WITH KNOWN-GOOD-DIES

Patent #:	10149377	Issue Dt:	12/04/2018	Application #:	15192549	Filing Dt:	06/24/2016
Publication #:	US20170374734	Pub Dt:	12/28/2017
Title:	STACKED TRANSMISSION LINE

Patent #:	9935075	Issue Dt:	04/03/2018	Application #:	15237936	Filing Dt:	08/16/2016
Publication #:	US20180033764	Pub Dt:	02/01/2018
Title:	Wire Bonding Method and Apparatus for Electromagnetic Interference Shielding

Patent #:	10032751	Issue Dt:	07/24/2018	Application #:	15247705	Filing Dt:	08/25/2016
Publication #:	US20170092620	Pub Dt:	03/30/2017
Title:	Ultrathin layer for forming a capacitive interface between joined Integrated Circuit Components

Patent #:	10008477	Issue Dt:	06/26/2018	Application #:	15286086	Filing Dt:	10/05/2016
Publication #:	US20170025390	Pub Dt:	01/26/2017
Title:	MICROELECTRONIC ELEMENT WITH BOND ELEMENTS TO ENCAPSULATION SURFACE

Patent #:	10026467	Issue Dt:	07/17/2018	Application #:	15337323	Filing Dt:	10/28/2016
Publication #:	US20170133081	Pub Dt:	05/11/2017
Title:	HIGH-BANDWIDTH MEMORY APPLICATION WITH CONTROLLED IMPEDANCE LOADING

Patent #:	9812402	Issue Dt:	11/07/2017	Application #:	15344990	Filing Dt:	11/07/2016
Publication #:	US20170117231	Pub Dt:	04/27/2017
Title:	WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Patent #:	9852994	Issue Dt:	12/26/2017	Application #:	15354061	Filing Dt:	11/17/2016
Publication #:	US20170170121	Pub Dt:	06/15/2017
Title:	EMBEDDED VIALESS BRIDGES

Patent #:	10014243	Issue Dt:	07/03/2018	Application #:	15403679	Filing Dt:	01/11/2017
Publication #:	US20170125331	Pub Dt:	05/04/2017
Title:	INTERCONNECTION SUBSTRATES FOR INTERCONNECTION BETWEEN CIRCUIT MODULES, AND METHODS OF MANUFACTURE

Patent #:	10163833	Issue Dt:	12/25/2018	Application #:	15584961	Filing Dt:	05/02/2017
Publication #:	US20170236794	Pub Dt:	08/17/2017
Title:	Multichip modules and methods of fabrication

Patent #:	9972582	Issue Dt:	05/15/2018	Application #:	15670382	Filing Dt:	08/07/2017
Publication #:	US20180040572	Pub Dt:	02/08/2018
Title:	Warpage Balancing in Thin Packages

Patent #:	10262717	Issue Dt:	04/16/2019	Application #:	15803710	Filing Dt:	11/03/2017
Publication #:	US20180114561	Pub Dt:	04/26/2018
Title:	DRAM Adjacent Row Disturb Mitigation

Patent #:	10115678	Issue Dt:	10/30/2018	Application #:	15804122	Filing Dt:	11/06/2017
Publication #:	US20180061774	Pub Dt:	03/01/2018
Title:	WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Patent #:	10515926	Issue Dt:	12/24/2019	Application #:	15834658	Filing Dt:	12/07/2017
Publication #:	US20180096973	Pub Dt:	04/05/2018
Title:	SYSTEM AND METHOD FOR PROVIDING 3D WAFER ASSEMBLY WITH KNOWN-GOOD-DIES

Patent #:	10083909	Issue Dt:	09/25/2018	Application #:	15845333	Filing Dt:	12/18/2017
Publication #:	US20180108612	Pub Dt:	04/19/2018
Title:	Embedded Vialess Bridges

Patent #:	10269853	Issue Dt:	04/23/2019	Application #:	15875067	Filing Dt:	01/19/2018
Publication #:	US20180145105	Pub Dt:	05/24/2018
Title:	Image Sensor Device

Patent #:	10658302	Issue Dt:	05/19/2020	Application #:	15914617	Filing Dt:	03/07/2018
Publication #:	US20180197834	Pub Dt:	07/12/2018
Title:	WIRE BONDING METHOD AND APPARATUS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING

Patent #:	10325877	Issue Dt:	06/18/2019	Application #:	15959619	Filing Dt:	04/23/2018
Publication #:	US20180240773	Pub Dt:	08/23/2018
Title:	EMBEDDED WIRE BOND WIRES FOR VERTICAL INTEGRATION WITH SEPARATE SURFACE MOUNT AND WIRE BOND MOUNTING SURFACES

Patent #:	10483217	Issue Dt:	11/19/2019	Application #:	15977905	Filing Dt:	05/11/2018
Publication #:	US20180261556	Pub Dt:	09/13/2018
Title:	Warpage Balancing In Thin Packages

Patent #:	10750614	Issue Dt:	08/18/2020	Application #:	15980894	Filing Dt:	05/16/2018
Publication #:	US20180359855	Pub Dt:	12/13/2018
Title:	Deformable Electrical Contacts With Conformable Target Pads

Patent #:	10290612	Issue Dt:	05/14/2019	Application #:	15993271	Filing Dt:	05/30/2018
Title:	Systems and Methods for Flash Stacking

Patent #:	10586759	Issue Dt:	03/10/2020	Application #:	16017010	Filing Dt:	06/25/2018
Publication #:	US20180337118	Pub Dt:	11/22/2018
Title:	Interconnection Substrates for Interconnection Between Circuit Modules, and Methods of Manufacture

Patent #:	10600760	Issue Dt:	03/24/2020	Application #:	16020654	Filing Dt:	06/27/2018
Publication #:	US20180366446	Pub Dt:	12/20/2018
Title:	ULTRATHIN LAYER FOR FORMING A CAPACITIVE INTERFACE BETWEEN JOINED INTEGRATED CIRCUIT COMPONENT

Patent #:	10559537	Issue Dt:	02/11/2020	Application #:	16127110	Filing Dt:	09/10/2018
Publication #:	US20190027444	Pub Dt:	01/24/2019
Title:	WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Patent #:	10347582	Issue Dt:	07/09/2019	Application #:	16136635	Filing Dt:	09/20/2018
Publication #:	US20190019754	Pub Dt:	01/17/2019
Title:	EMBEDDED VIALESS BRIDGES

Patent #:	10955671	Issue Dt:	03/23/2021	Application #:	16136776	Filing Dt:	09/20/2018
Publication #:	US20190273016	Pub Dt:	09/05/2019
Title:	STRETCHABLE FILM ASSEMBLY WITH CONDUCTIVE TRACES

Patent #:	11195748	Issue Dt:	12/07/2021	Application #:	16140995	Filing Dt:	09/25/2018
Publication #:	US20190096741	Pub Dt:	03/28/2019
Title:	INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME

Patent #:	11369020	Issue Dt:	06/21/2022	Application #:	16172271	Filing Dt:	10/26/2018
Publication #:	US20190069392	Pub Dt:	02/28/2019
Title:	STACKED TRANSMISSION LINE

Patent #:	10490520	Issue Dt:	11/26/2019	Application #:	16196313	Filing Dt:	11/20/2018
Publication #:	US20190088607	Pub Dt:	03/21/2019
Title:	MULTICHIP MODULES AND METHODS OF FABRICATION

Patent #:	10811388	Issue Dt:	10/20/2020	Application #:	16212248	Filing Dt:	12/06/2018
Publication #:	US20190115323	Pub Dt:	04/18/2019
Title:	CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONIC DEVICES

Patent #:	10802285	Issue Dt:	10/13/2020	Application #:	16292705	Filing Dt:	03/05/2019
Publication #:	US20190272802	Pub Dt:	09/05/2019
Title:	REMOTE OPTICAL ENGINE FOR VIRTUAL REALITY OR AUGMENTED REALITY HEADSETS

Patent #:	10593651	Issue Dt:	03/17/2020	Application #:	16368219	Filing Dt:	03/28/2019
Publication #:	US20190371765	Pub Dt:	12/05/2019
Title:	SYSTEMS AND METHODS FOR FLASH STACKING

Patent #:	10847562	Issue Dt:	11/24/2020	Application #:	16370747	Filing Dt:	03/29/2019
Publication #:	US20190229142	Pub Dt:	07/25/2019
Title:	IMAGE SENSOR DEVICE

Patent #:	10600761	Issue Dt:	03/24/2020	Application #:	16378921	Filing Dt:	04/09/2019
Publication #:	US20190237437	Pub Dt:	08/01/2019
Title:	NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES

Patent #:	11398258	Issue Dt:	07/26/2022	Application #:	16397569	Filing Dt:	04/29/2019
Publication #:	US20190333550	Pub Dt:	10/31/2019
Title:	MULTI-DIE MODULE WITH LOW POWER OPERATION

Patent #:	11069734	Issue Dt:	07/20/2021	Application #:	16513489	Filing Dt:	07/16/2019
Publication #:	US20190348459	Pub Dt:	11/14/2019
Title:	IMAGE SENSOR DEVICE

Patent #:	11264361	Issue Dt:	03/01/2022	Application #:	16678342	Filing Dt:	11/08/2019
Publication #:	US20200388592	Pub Dt:	12/10/2020
Title:	Network On Layer Enabled Architectures

Patent #:	11114408	Issue Dt:	09/07/2021	Application #:	16687498	Filing Dt:	11/18/2019
Publication #:	US20200091110	Pub Dt:	03/19/2020
Title:	SYSTEM AND METHOD FOR PROVIDING 3D WAFER ASSEMBLY WITH KNOWN-GOOD-DIES

Patent #:	11462483	Issue Dt:	10/04/2022	Application #:	16715524	Filing Dt:	12/16/2019
Publication #:	US20200118939	Pub Dt:	04/16/2020
Title:	WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Patent #:	10991676	Issue Dt:	04/27/2021	Application #:	16814175	Filing Dt:	03/10/2020
Publication #:	US20200212013	Pub Dt:	07/02/2020
Title:	SYSTEMS AND METHODS FOR FLASH STACKING

Patent #:	11605614	Issue Dt:	03/14/2023	Application #:	16823391	Filing Dt:	03/19/2020
Publication #:	US20200219852	Pub Dt:	07/09/2020
Title:	CORRECTION DIE FOR WAFER/DIE STACK

Patent #:	11335647	Issue Dt:	05/17/2022	Application #:	16833445	Filing Dt:	03/27/2020
Publication #:	US20200227360	Pub Dt:	07/16/2020
Title:	WIRE BONDING METHOD AND APPARATUS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING

Patent #:	11270979	Issue Dt:	03/08/2022	Application #:	16842199	Filing Dt:	04/07/2020
Publication #:	US20200387471	Pub Dt:	12/10/2020
Title:	Symbiotic Network On Layers

Patent #:	11804469	Issue Dt:	10/31/2023	Application #:	16868701	Filing Dt:	05/07/2020
Publication #:	US20210351159	Pub Dt:	11/11/2021
Title:	ACTIVE BRIDGING APPARATUS

Patent #:	NONE	Issue Dt:		Application #:	16905766	Filing Dt:	06/18/2020
Publication #:	US20200402913	Pub Dt:	12/24/2020
Title:	CONNECTING MULTIPLE CHIPS USING AN INTERCONNECT DEVICE

Patent #:	10969593	Issue Dt:	04/06/2021	Application #:	17019080	Filing Dt:	09/11/2020
Publication #:	US20200409157	Pub Dt:	12/31/2020
Title:	REMOTE OPTICAL ENGINE FOR VIRTUAL REALITY OR AUGMENTED REALITY HEADSETS

Patent #:	11495579	Issue Dt:	11/08/2022	Application #:	17074401	Filing Dt:	10/19/2020
Publication #:	US20210035954	Pub Dt:	02/04/2021
Title:	CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONIC DEVICES

Patent #:	11599299	Issue Dt:	03/07/2023	Application #:	17098299	Filing Dt:	11/13/2020
Publication #:	US20210149586	Pub Dt:	05/20/2021
Title:	3D MEMORY CIRCUIT

Patent #:	NONE	Issue Dt:		Application #:	17182016	Filing Dt:	02/22/2021
Publication #:	US20210181511	Pub Dt:	06/17/2021
Title:	STRETCHABLE FILM ASSEMBLY WITH CONDUCTIVE TRACES

Patent #:	NONE	Issue Dt:		Application #:	17217749	Filing Dt:	03/30/2021
Publication #:	US20210225811	Pub Dt:	07/22/2021
Title:	SYSTEMS AND METHODS FOR FLASH STACKING

Patent #:	11935907	Issue Dt:	03/19/2024	Application #:	17353103	Filing Dt:	06/21/2021
Publication #:	US20210366970	Pub Dt:	11/25/2021
Title:	IMAGE SENSOR DEVICE

Patent #:	NONE	Issue Dt:		Application #:	17517247	Filing Dt:	11/02/2021
Publication #:	US20220130714	Pub Dt:	04/28/2022
Title:	INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME

Patent #:	NONE	Issue Dt:		Application #:	17577944	Filing Dt:	01/18/2022
Publication #:	US20220139883	Pub Dt:	05/05/2022
Title:	Network On Layer Enabled Architectures

Patent #:	11824046	Issue Dt:	11/21/2023	Application #:	17583872	Filing Dt:	01/25/2022
Publication #:	US20220150184	Pub Dt:	05/12/2022
Title:	Symbiotic Network On Layers

Assignor

INVENSAS CORPORATION

Exec Dt:

10/01/2021

Assignee

INVENSAS LLC

3025 ORCHARD PARKWAY

SAN JOSE, CALIFORNIA 95134

Correspondence name and address
	HALEY GUILIANO LLP
	111 NORTH MARKET ST., SUITE 900
	SAN JOSE, CA 95113

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