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Total properties:
20
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Patent #:
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Issue Dt:
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07/01/1997
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Application #:
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08116309
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Filing Dt:
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09/03/1993
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Title:
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LOW TEMPERATURE DEPOSITION OF SILICON OXIDES FOR DEVICE FABRICATION
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Patent #:
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Issue Dt:
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11/27/2001
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Application #:
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08329806
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Filing Dt:
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10/26/1994
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Title:
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TUNGSTEN FORMATION PROCESS
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Patent #:
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Issue Dt:
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06/04/1996
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Application #:
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08349649
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Filing Dt:
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12/05/1994
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Title:
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METHOD OF FORMING METAL LAYERS FORMED AS A COMPOSITE OF SUB-LAYERS USING TI TEXTURE CONTROL LAYER
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Patent #:
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Issue Dt:
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11/19/1996
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Application #:
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08353015
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Filing Dt:
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12/09/1994
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Title:
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METHOD FOR MAKING A METAL TO METAL CAPACITOR
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Patent #:
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Issue Dt:
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02/04/1997
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Application #:
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08366867
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Filing Dt:
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12/30/1994
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Title:
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NOVEL BARRIER LAYER TREATMENTS FOR TUNGSTEN PLUG
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Patent #:
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Issue Dt:
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08/05/1997
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Application #:
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08472033
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Filing Dt:
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06/06/1995
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Title:
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INTEGRATED CIRCUIT CAPACITOR
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Patent #:
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Issue Dt:
|
12/22/1998
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Application #:
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08644086
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Filing Dt:
|
05/09/1996
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Title:
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METHOD FOR MAKING A CAPACITOR
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|
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Patent #:
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|
Issue Dt:
|
12/02/1997
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Application #:
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08645852
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Filing Dt:
|
05/14/1996
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Title:
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METHOD OF INTEGRATED CIRCUIT FABRICATION INCLUDING A STEP OF DEPOSITING TUNGSTEN
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Patent #:
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|
Issue Dt:
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09/14/1999
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Application #:
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08747325
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Filing Dt:
|
11/12/1996
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Title:
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FLIP CHIP BUMP DISTRIBUTION ON DIE
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Patent #:
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Issue Dt:
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10/20/1998
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Application #:
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08863713
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Filing Dt:
|
05/27/1997
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Title:
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AN ELECTRONIC COMPONENT FOR AN INTEGRATED CIRCUIT
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Patent #:
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Issue Dt:
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03/23/1999
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Application #:
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08909312
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Filing Dt:
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08/11/1997
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Title:
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METHOD FOR DISTRIBUTING CONNECTION PADS ON A SEMICONDUCTOR DIE
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Patent #:
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Issue Dt:
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03/21/2000
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Application #:
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08909563
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Filing Dt:
|
08/12/1997
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Title:
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A DEVICE AND METHOD OF FORMING A METAL TO METAL CAPACITOR WITHIN AN INTEGRATED CIRCUIT
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|
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Patent #:
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Issue Dt:
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09/12/2000
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Application #:
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09193832
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Filing Dt:
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11/17/1998
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Title:
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HEATSPREADER FOR A FLIP CHIP DEVICE, AND METHOD FOR CONNECTING THE HEATSPREADER
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|
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Patent #:
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Issue Dt:
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02/27/2001
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Application #:
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09212228
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Filing Dt:
|
12/16/1998
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|
Title:
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DEEP SUB-MICRON METAL ETCH WITH IN-SITU HARD MASK ETCH
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Patent #:
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Issue Dt:
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11/28/2000
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Application #:
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09370422
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Filing Dt:
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08/09/1999
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Title:
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HIGH DENSITY PLASMA PASSIVATION LAYER AND METHOD OF APPLICATION
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|
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Patent #:
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Issue Dt:
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01/22/2002
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Application #:
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09478647
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Filing Dt:
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01/06/2000
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Title:
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DIFFUSION BARRIER FOR USE WITH HIGH DIELECTRIC CONSTANT MATERIALS AND ELECTRONIC DEVICES INCORPORATING SAME
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|
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Patent #:
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Issue Dt:
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01/27/2004
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Application #:
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09496989
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Filing Dt:
|
02/02/2000
|
|
Title:
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HEATSPREADER FOR A FLIP CHIP DEVICE, AND METHOD FOR CONNECTING THE HEATSPREADER
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|
|
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Patent #:
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|
Issue Dt:
|
07/08/2003
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Application #:
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09752626
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Filing Dt:
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12/28/2000
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|
Title:
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SIX-TO-ONE SIGNAL/POWER RATIO BUMP AND TRACE PATTERN FOR FLIP CHIP DESIGN
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Patent #:
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Issue Dt:
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10/29/2002
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Application #:
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09864577
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Filing Dt:
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05/24/2001
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Publication #:
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Pub Dt:
|
11/01/2001
| | | | |
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Title:
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WIRE BONDING TO COPPER
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Patent #:
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Issue Dt:
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09/28/2004
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Application #:
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10600255
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Filing Dt:
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06/20/2003
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Title:
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BONDING PAD FOR LOW K DIELECTRIC
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