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NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	059723/0382			Pages:	236
		Recorded:	04/15/2022
Conveyance:	RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).

Total properties: 524
Page 1 of 6
Pages: 1 2 3 4 5 6

1

Patent #:	5111279	Issue Dt:	05/05/1992	Application #:	07576182	Filing Dt:	08/30/1990
Title:	APPARATUS FOR ISOLATION OF FLUX MATERIALS IN "FLIP-CHIP" MANUFACTURING

2

Patent #:	5168346	Issue Dt:	12/01/1992	Application #:	07775009	Filing Dt:	10/11/1991
Title:	METHOD AND APPARATUS FOR ISOLATION OF FLUX MATERIALS IN FLIP-CHIP MANUFACTURING

3

Patent #:	5831836	Issue Dt:	11/03/1998	Application #:	07828468	Filing Dt:	01/30/1992
Title:	POWER PLANE FOR SEMICONDUCTOR DEVICE

4

Patent #:	5262927	Issue Dt:	11/16/1993	Application #:	07834182	Filing Dt:	02/07/1992
Title:	PARTIALLY-MOLDED, PCB CHIP CARRIER PACKAGE

5

Patent #:	5340772	Issue Dt:	08/23/1994	Application #:	07916328	Filing Dt:	07/17/1992
Title:	METHOD OF INCREASING THE LAYOUT EFFICIENCY OF DIES ON A WAFER AND INCREASING THE RATIO OF I/O AREA TO ACTIVE AREA PER DIE

6

Patent #:	5329157	Issue Dt:	07/12/1994	Application #:	07933430	Filing Dt:	08/21/1992
Title:	SEMICONDUCTOR PACKAGING TECHNIQUE YIELDING INCREASED INNER LEAD COUNT FOR A GIVEN DIE-RECEIVING AREA

7

Patent #:	5300815	Issue Dt:	04/05/1994	Application #:	07935449	Filing Dt:	08/25/1992
Title:	TECHNIQUE OF INCREASING BOND PAD DENSITY ON A SEMICONDUCTOR DIE

8

Patent #:	6077725	Issue Dt:	06/20/2000	Application #:	07940157	Filing Dt:	09/03/1992
Title:	METHOD FOR ASSEMBLING MULTICHIP MODULES

9

Patent #:	5248903	Issue Dt:	09/28/1993	Application #:	07947854	Filing Dt:	09/18/1992
Title:	COMPOSITE BOND PADS FOR SEMICONDUCTOR DEVICES

10

Patent #:	5399898	Issue Dt:	03/21/1995	Application #:	07975185	Filing Dt:	11/12/1992
Title:	MULTI-CHIP SEMICONDUCTOR ARRANGEMENTS USING FLIP CHIP DIES

11

Patent #:	5299730	Issue Dt:	04/05/1994	Application #:	07981096	Filing Dt:	11/24/1992
Title:	METHOD AND APPARATUS FOR ISOLATION OF FLUX MATERIALS IN FLIP-CHIP MANUFACTURING

12

Patent #:	5284797	Issue Dt:	02/08/1994	Application #:	07984206	Filing Dt:	11/30/1992
Title:	SEMICONDUCTOR BOND PADS

13

Patent #:	5404047	Issue Dt:	04/04/1995	Application #:	07995644	Filing Dt:	12/18/1992
Title:	SEMICONDUCTOR DIE HAVING A HIGH DENSITY ARRAY OF COMPOSITE BOND PADS

14

Patent #:	5434750	Issue Dt:	07/18/1995	Application #:	08079499	Filing Dt:	06/18/1993
Title:	PARTIALLY-MOLDED, PCB CHIP CARRIER PACKAGE FOR CERTAIN NON-SQUARE DIE SHAPES

15

Patent #:	5347162	Issue Dt:	09/13/1994	Application #:	08105838	Filing Dt:	08/12/1993
Title:	PREFORMED PLANAR STRUCTURES EMPLOYING EMBEDDED CONDUCTORS

16

Patent #:	5489804	Issue Dt:	02/06/1996	Application #:	08106157	Filing Dt:	08/12/1993
Title:	FLEXIBLE PREFORMED PLANAR STRUCTURES FOR INTERPOSING BETWEEN A CHIP AND A SUBSTRATE

17

Patent #:	5834792	Issue Dt:	11/10/1998	Application #:	08111765	Filing Dt:	08/25/1993
Title:	ARTICLES COMPRISING DOPED SEMICONDUCTOR MATERIAL

18

Patent #:	5410451	Issue Dt:	04/25/1995	Application #:	08170102	Filing Dt:	12/20/1993
Title:	LOCATION AND STANDOFF PINS FOR CHIP ON TAPE

19

Patent #:	5435482	Issue Dt:	07/25/1995	Application #:	08192081	Filing Dt:	02/04/1994
Title:	INTEGRATED CIRCUIT HAVING A COPLANAR SOLDER BALL CONTACT ARRAY

20

Patent #:	5410805	Issue Dt:	05/02/1995	Application #:	08194241	Filing Dt:	02/10/1994
Title:	METHOD AND APPARATUS FOR ISOLATION OF FLUX MATERIALS IN "FLIP-CHIP" MANUFACTURING

21

Patent #:	5644102	Issue Dt:	07/01/1997	Application #:	08203919	Filing Dt:	03/01/1994
Title:	INTEGRATED CIRCUIT PACKAGES WITH DISTINCTIVE COLORATION

22

Patent #:	5441917	Issue Dt:	08/15/1995	Application #:	08251058	Filing Dt:	05/31/1994
Title:	METHOD OF LAYING OUT BOND PADS ON A SEMICONDUCTOR DIE

23

Patent #:	5468681	Issue Dt:	11/21/1995	Application #:	08260078	Filing Dt:	06/15/1994
Title:	PROCESS FOR INTERCONNECTING CONDUCTIVE SUBSTRATES USING AN INTERPOSER HAVING CONDUCTIVE PLASTIC FILLED VIAS

24

Patent #:	5465470	Issue Dt:	11/14/1995	Application #:	08299209	Filing Dt:	08/31/1994
Title:	FIXTURE FOR ATTACHING MULTIPLE LIDS TO MULTI-CHIP MODULE (MCM) INTEGRATED CIRCUIT

25

Patent #:	5537342	Issue Dt:	07/16/1996	Application #:	08331251	Filing Dt:	10/28/1994
Title:	ENCAPSULATION OF ELECTRONIC COMPONENTS

26

Patent #:	5505367	Issue Dt:	04/09/1996	Application #:	08333168	Filing Dt:	11/02/1994
Title:	METHOD FOR BUMPING SILICON DEVICES

27

Patent #:	5583285	Issue Dt:	12/10/1996	Application #:	08346454	Filing Dt:	11/29/1994
Title:	METHOD FOR DETECTING A COATING MATERIAL ON A SUBSTRATE

28

Patent #:	5607882	Issue Dt:	03/04/1997	Application #:	08359973	Filing Dt:	12/20/1994
Title:	MULTI-COMPONENT ELECTRONIC DEVICES AND METHODS FOR MAKING THEM

29

Patent #:	5501777	Issue Dt:	03/26/1996	Application #:	08366539	Filing Dt:	12/30/1994
Title:	METHOD FOR TESTING SOLDER MASK MATERIAL

30

Patent #:	5600182	Issue Dt:	02/04/1997	Application #:	08378027	Filing Dt:	01/24/1995
Title:	BARRIER METAL TECHNOLOGY FOR TUNGSTEN PLUG INTERCONNECTION

31

Patent #:	5565385	Issue Dt:	10/15/1996	Application #:	08387154	Filing Dt:	02/10/1995
Title:	SEMICONDUCTOR BOND PAD STRUCTURE AND INCREASED BOND PAD COUNT PER DIE

32

Patent #:	5608262	Issue Dt:	03/04/1997	Application #:	08393628	Filing Dt:	02/24/1995
Title:	PACKAGING MULTI-CHIP MODULES WITHOUT WIRE-BOND INTERCONNECTION

33

Patent #:	5610442	Issue Dt:	03/11/1997	Application #:	08412087	Filing Dt:	03/27/1995
Title:	SEMICONDUCTOR DEVICE PACKAGE FABRICATION METHOD AND APPARATUS

34

Patent #:	5532934	Issue Dt:	07/02/1996	Application #:	08416457	Filing Dt:	04/03/1995
Title:	FLOORPLANNING TECHNIQUE USING MULTI-PARTITIONING BASED ON A PARTITION COST FACTOR FOR NON-SQUARE SHAPED PARTITONS

35

Patent #:	6313519	Issue Dt:	11/06/2001	Application #:	08424828	Filing Dt:	04/19/1995
Title:	SUPPORT FOR SEMICONDUCTOR BOND WIRES

36

Patent #:	5569963	Issue Dt:	10/29/1996	Application #:	08428323	Filing Dt:	04/25/1995
Title:	PREFORMED PLANAR STRUCTURES FOR SEMICONDUCTOR DEVICE ASSEMBLIES

37

Patent #:	5557150	Issue Dt:	09/17/1996	Application #:	08429605	Filing Dt:	04/27/1995
Title:	OVERMOLDED SEMICONDUCTOR PACKAGE

38

Patent #:	5635424	Issue Dt:	06/03/1997	Application #:	08430399	Filing Dt:	04/28/1995
Title:	HIGH DENSITY BOND PAD LAYOUT ARRANGEMENTS FIR SEMICONDUCTOR DIES, AND CONNECTING TO THE BOND PADS

39

Patent #:	5627407	Issue Dt:	05/06/1997	Application #:	08430664	Filing Dt:	04/28/1995
Title:	ELECTRONIC PACKAGE WITH REDUCED BENDING STRESS

40

Patent #:	5619068	Issue Dt:	04/08/1997	Application #:	08430665	Filing Dt:	04/28/1995
Title:	EXTERNALLY BONDABLE OVERMOLDED PACKAGE ARRANGEMENTS

41

Patent #:	5594626	Issue Dt:	01/14/1997	Application #:	08432535	Filing Dt:	05/02/1995
Title:	PARTIALLY-MOLDED, PCB CHIP CARRIER PACKAGE FOR CERTAIN NON-SQUARE DIE SHAPES

42

Patent #:	5700715	Issue Dt:	12/23/1997	Application #:	08434276	Filing Dt:	05/03/1995
Title:	PROCESS FOR MOUNTING A SEMICONDUCTOR DEVICE TO A CIRCUIT SUBBSTRATE

43

Patent #:	5622305	Issue Dt:	04/22/1997	Application #:	08438296	Filing Dt:	05/10/1995
Title:	BONDING SCHEME USING GROUP VB METALLIC LAYER

44

Patent #:	5821624	Issue Dt:	10/13/1998	Application #:	08470945	Filing Dt:	06/05/1995
Title:	SEMICONDUCTOR DEVICE ASSEMBLY TECHNIQUES USING PREFORMED PLANAR STRUCTURES

45

Patent #:	5744856	Issue Dt:	04/28/1998	Application #:	08476431	Filing Dt:	06/07/1995
Title:	NON-SQUARE DIE FOR INTEGRATED CIRCUITS AND SYSTEMS CONTAINING THE SAME

46

Patent #:	5564617	Issue Dt:	10/15/1996	Application #:	08479587	Filing Dt:	06/07/1995
Title:	METHOD AND APPARATUS FOR ASSEMBLING MULTICHIP MODULES

47

Patent #:	5663872	Issue Dt:	09/02/1997	Application #:	08484177	Filing Dt:	06/07/1995
Title:	ENCAPSULATION OF ELECTRONIC COMPONENTS

48

Patent #:	5739584	Issue Dt:	04/14/1998	Application #:	08485060	Filing Dt:	06/07/1995
Title:	MULTIPLE PIN DIE PACKAGE

49

Patent #:	5646451	Issue Dt:	07/08/1997	Application #:	08486844	Filing Dt:	06/07/1995
Title:	MULTIFUNCTIONAL CHIP WIRE BONDS

50

Patent #:	5735698	Issue Dt:	04/07/1998	Application #:	08498738	Filing Dt:	07/06/1995
Title:	CONNECTOR FOR MOUNTING AN ELECTRICAL COMPONENT

51

Patent #:	5744084	Issue Dt:	04/28/1998	Application #:	08506164	Filing Dt:	07/24/1995
Title:	METHOD OF IMPROVING MOLDING OF AN OVERMOLDED PACKAGE BODY ON A SUBSTRATE

52

Patent #:	5621616	Issue Dt:	04/15/1997	Application #:	08536002	Filing Dt:	09/29/1995
Title:	HIGH DENSITY CMOS INTEGRATED CIRCUIT WITH HEAT TRANSFER STRUCTURE FOR IMPROVED COOLING

53

Patent #:	5695593	Issue Dt:	12/09/1997	Application #:	08538629	Filing Dt:	10/04/1995
Title:	METHOD OF CENTERING A HIGH PRESSURE LID SEAL

54

Patent #:	5716493	Issue Dt:	02/10/1998	Application #:	08538630	Filing Dt:	10/04/1995
Title:	HIGH PRESSURE LID SEAL CLIP APPARATUS

55

Patent #:	5637920	Issue Dt:	06/10/1997	Application #:	08538631	Filing Dt:	10/04/1995
Title:	HIGH CONTACT DENSITY BALL GRID ARRAY PACKAGE FOR FLIP-CHIPS

56

Patent #:	5632437	Issue Dt:	05/27/1997	Application #:	08538907	Filing Dt:	10/04/1995
Title:	METHOD OF CENTERING A LID SEAL CLIP

57

Patent #:	5786631	Issue Dt:	07/28/1998	Application #:	08539188	Filing Dt:	10/04/1995
Title:	CONFIGURABLE BALL GRID ARRAY PACKAGE

58

Patent #:	5598775	Issue Dt:	02/04/1997	Application #:	08539189	Filing Dt:	10/04/1995
Title:	CENTERING LID SEAL CLIP APPARATUS

59

Patent #:	5696405	Issue Dt:	12/09/1997	Application #:	08542995	Filing Dt:	10/13/1995
Title:	MICROELECTRONIC PACKAGE WITH DEVICE COOLING

60

Patent #:	5751065	Issue Dt:	05/12/1998	Application #:	08549990	Filing Dt:	10/30/1995
Title:	INTEGRATED CIRCUIT WITH ACTIVE DEVICES UNDER BOND PADS

61

Patent #:	5719733	Issue Dt:	02/17/1998	Application #:	08556599	Filing Dt:	11/13/1995
Title:	ESD PROTECTION FOR DEEP SUBMICRON CMOS DEVICES WITH MINIMUM TRADEOFF FOR LATCHUP BEHAVIOR

62

Patent #:	5767580	Issue Dt:	06/16/1998	Application #:	08573892	Filing Dt:	12/18/1995
Title:	SYSTEMS HAVING SHAPED, SELF-ALIGNING MICRO-BUMP STRUCTURES

63

Patent #:	5837380	Issue Dt:	11/17/1998	Application #:	08578816	Filing Dt:	12/26/1995
Title:	MULTILAYER STRUCTURES AND PROCESS FOR FABRICATING THE SAME

64

Patent #:	5814536	Issue Dt:	09/29/1998	Application #:	08578966	Filing Dt:	12/27/1995
Title:	METHOD OF MANUFACTURING POWDERED METAL SINKS HAVING INCREASED SURFACE AREA

65

Patent #:	5818102	Issue Dt:	10/06/1998	Application #:	08580800	Filing Dt:	12/29/1995
Title:	SYSTEM HAVING INTEGRATED CIRCUIT PACKAGE WITH LEAD FRAME HAVING INTERNAL POWER AND GROUND BUSSES

66

Patent #:	5918794	Issue Dt:	07/06/1999	Application #:	08581299	Filing Dt:	12/28/1995
Title:	SOLDER BONDING OF DENSE ARRAYS OF MICROMINITURE CONTACT PADS

67

Patent #:	5869869	Issue Dt:	02/09/1999	Application #:	08595021	Filing Dt:	01/31/1996
Title:	MICROELECTRONIC DEVICE WITH THIN FILM ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE

68

Patent #:	5793104	Issue Dt:	08/11/1998	Application #:	08608679	Filing Dt:	02/29/1996
Title:	APPARATUS FOR FORMING ELECTRICAL CONNECTIONS BETWEEN A SEMICONDUCTOR DIE AND A SEMICONDUCTOR PACKAGE

69

Patent #:	5801072	Issue Dt:	09/01/1998	Application #:	08615388	Filing Dt:	03/14/1996
Title:	METHOD OF PACKAGING INTEGRATED CIRCUITS

70

Patent #:	5723369	Issue Dt:	03/03/1998	Application #:	08615865	Filing Dt:	03/14/1996
Title:	METHOD OF FLIP CHIP ASSEMBLY

71

Patent #:	5686764	Issue Dt:	11/11/1997	Application #:	08619909	Filing Dt:	03/20/1996
Title:	FLIP CHIP PACKAGE WITH REDUCED NUMBER OF PACKAGE LAYERS

72

Patent #:	6078502	Issue Dt:	06/20/2000	Application #:	08627411	Filing Dt:	04/01/1996
Title:	SYSTEM HAVING HEAT DISSIPATING LEADFRAMES

73

Patent #:	5761048	Issue Dt:	06/02/1998	Application #:	08632952	Filing Dt:	04/16/1996
Title:	CONDUCTIVE POLYMER BALL ATTACHMENT FOR GRID ARRAY SEMICONDUCTOR PACKAGES

74

Patent #:	5667132	Issue Dt:	09/16/1997	Application #:	08633992	Filing Dt:	04/19/1996
Title:	METHOD FOR SOLDER-BONDING CONTACT PAD ARRAYS

75

Patent #:	6043100	Issue Dt:	03/28/2000	Application #:	08635288	Filing Dt:	04/19/1996
Title:	CHIP ON TAPE DIE REFRAME PROCESS

76

Patent #:	5741430	Issue Dt:	04/21/1998	Application #:	08638003	Filing Dt:	04/25/1996
Title:	CONDUCTIVE ADHESIVE BONDING MEANS

77

Patent #:	5780924	Issue Dt:	07/14/1998	Application #:	08644000	Filing Dt:	05/07/1996
Title:	INTEGRATED CIRCUIT UNDERFILL RESERVOIR

78

Patent #:	5923538	Issue Dt:	07/13/1999	Application #:	08646037	Filing Dt:	05/07/1996
Title:	SUPPORT MEMBER FOR MOUNTING A MICROELECTRONIC CIRCUIT PACKAGE

79

Patent #:	5777383	Issue Dt:	07/07/1998	Application #:	08647344	Filing Dt:	05/09/1996
Title:	SEMICONDUCTOR CHIP PACKAGE WITH INTERCONNECT LAYERS AND ROUTING AND TESTING METHODS

80

Patent #:	5700723	Issue Dt:	12/23/1997	Application #:	08648350	Filing Dt:	05/15/1996
Title:	METHOD OF PACKAGING AN INTEGRATED CIRCUIT

81

Patent #:	5691568	Issue Dt:	11/25/1997	Application #:	08656033	Filing Dt:	05/31/1996
Title:	WIRE BONDABLE PACKAGE DESIGN WITH MAXIUM ELECTRICAL PERFORMANCE AND MINIMUM NUMBER OF LAYERS

82

Patent #:	5672913	Issue Dt:	09/30/1997	Application #:	08663336	Filing Dt:	06/13/1996
Title:	SEMICONDUCTOR DEVICE HAVING A LAYER OF GALLIUM AMALGAM ON BUMP LEADS

83

Patent #:	5729894	Issue Dt:	03/24/1998	Application #:	08664146	Filing Dt:	06/14/1996
Title:	METHOD OF ASSEMBLING BALL BUMP GRID ARRAY SEMICONDUCTOR PACKAGES

84

Patent #:	5834799	Issue Dt:	11/10/1998	Application #:	08679949	Filing Dt:	07/15/1996
Title:	OPTICALLY TRANSMISSIVE PREFORMED PLANAR STRUCTURES

85

Patent #:	5731635	Issue Dt:	03/24/1998	Application #:	08692852	Filing Dt:	07/24/1996
Title:	SEMICONDUCTOR DEVICE HAVING A CARRIER AND A MULTILAYER METALLIZATION

86

Patent #:	5646828	Issue Dt:	07/08/1997	Application #:	08697121	Filing Dt:	08/20/1996
Title:	THIN PACKAGING OF MULTI-CHIP MODULES WITH ENHANCED THERMAL POWER MANAGEMENT

87

Patent #:	5898575	Issue Dt:	04/27/1999	Application #:	08710573	Filing Dt:	09/19/1996
Title:	SUPPORT ASSEMBLY FOR MOUNTING AN INTEGRATED CIRCUIT PACKAGE ON A SURFACE

88

Patent #:	5896651	Issue Dt:	04/27/1999	Application #:	08713174	Filing Dt:	09/12/1996
Title:	METHOD OF MOUNTING MICROELECTRONIC CIRCUIT PACKAGE

89

Patent #:	5899737	Issue Dt:	05/04/1999	Application #:	08717601	Filing Dt:	09/20/1996
Title:	FLUXLESS SOLDER BALL ATTACHMENT PROCESS

90

Patent #:	5827777	Issue Dt:	10/27/1998	Application #:	08718852	Filing Dt:	09/24/1996
Title:	METHOD OF MAKING A BARRIER METAL TECHNOLOGY FOR TUNGSTEN PLUG INTERCONNECTION

91

Patent #:	5731223	Issue Dt:	03/24/1998	Application #:	08719266	Filing Dt:	09/24/1996
Title:	ARRAY OF SOLDER PADS ON AN INTEGRATED CIRCUIT

92

Patent #:	5744858	Issue Dt:	04/28/1998	Application #:	08720219	Filing Dt:	09/26/1996
Title:	SEMICONDUCTOR PACKAGING TECHNIQUE YIELDING INCREASED INNER LEAD COUNT FOR A GIVEN DIE-RECEIVING AREA

93

Patent #:	5955762	Issue Dt:	09/21/1999	Application #:	08723140	Filing Dt:	10/01/1996
Title:	MICROELECTRONIC PACKAGE WITH POLYMER ESD PROTECTION

94

Patent #:	5719449	Issue Dt:	02/17/1998	Application #:	08724129	Filing Dt:	09/30/1996
Title:	FLIP-CHIP INTEGRATED CIRCUIT WITH IMPROVED TESTABILITY

95

Patent #:	5952726	Issue Dt:	09/14/1999	Application #:	08747325	Filing Dt:	11/12/1996
Title:	FLIP CHIP BUMP DISTRIBUTION ON DIE

96

Patent #:	5747982	Issue Dt:	05/05/1998	Application #:	08761047	Filing Dt:	12/05/1996
Title:	MULTI-CHIP MODULES WITH ISOLATED COUPLING BETWEEN MODULES

97

Patent #:	6020221	Issue Dt:	02/01/2000	Application #:	08764039	Filing Dt:	12/12/1996
Title:	PROCESS FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING STIFFENER MEMBER

98

Patent #:	5814881	Issue Dt:	09/29/1998	Application #:	08770872	Filing Dt:	12/20/1996
Title:	STACKED INTEGRATED CHIP PACKAGE AND METHOD OF MAKING SAME

99

Patent #:	5973393	Issue Dt:	10/26/1999	Application #:	08771636	Filing Dt:	12/20/1996
Title:	APPARATUS AND METHOD FOR STACKABLE MOLDED LEAD FRAME BALL GRID ARRAY PACKAGING OF INTEGRATED CIRCUITS

100

Patent #:	5776551	Issue Dt:	07/07/1998	Application #:	08771955	Filing Dt:	12/23/1996
Title:	USE OF PLASMA ACTIVATED NF3 TO CLEAN SOLDER BUMPS ON A DEVICE

Assignor

1

CORTLAND CAPITAL MARKET SERVICES LLC

Exec Dt:

04/01/2022

Assignees

1

HILCO PATENT ACQUISITION 56, LLC

401 N. MICHIGAN AVE., SUITE 1630

CHICAGO, ILLINOIS 60611

2

BELL SEMICONDUCTOR, LLC

401 N. MICHIGAN AVE., SUITE 1630

CHICAGO, ILLINOIS 60611

3

BELL NORTHERN RESEARCH, LLC

401 N. MICHIGAN AVE., SUITE 1630

CHICAGO, ILLINOIS 60611

Correspondence name and address
	JOSHUA GAMMON
	401 N. MICHIGAN AVE.
	SUITE 1630
	CHICAGO, IL 60611

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