Patent Assignment Details
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| Reel/Frame: | 059733/0330 | |
| Pages: | 14 |
| | Recorded: | 04/26/2022 | | |
| Attorney Dkt #: | TSMCP893USC |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17729286
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Filing Dt:
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04/26/2022
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Publication #:
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Pub Dt:
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08/18/2022
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Title:
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HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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ESCHWEILER & POTASHNIK, LLC
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629 EUCLID AVE.
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SUITE 1101
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CLEVELAND, OH 44114
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