Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 059785/0635 | |
| Pages: | 6 |
| | Recorded: | 03/17/2022 | | |
| Attorney Dkt #: | 089994-0025 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/28/2023
|
Application #:
|
17628842
|
Filing Dt:
|
01/20/2022
|
|
Publication #:
|
|
Pub Dt:
|
08/25/2022
| | | | |
|
Title:
|
Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
|
|
|
Assignees
|
|
|
|
|
| 13-1, NIHONBASHI 1-CHOME, CHUO-KU |
| TOKYO, JAPAN 1030027 |
|
|
|
|
|
| 158-1, OAZA SAYAMAGAHARA, IRUMA-SHI |
| SAITAMA, JAPAN 3580032 |
|
|
Correspondence name and address
|
| |
MCDERMOTT WILL & EMERY LLP
|
| |
500 NORTH CAPITOL STREET, N.W.
|
| |
WASHINGTON, DC 20001
|
Search Results as of:
04/29/2024 02:33 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
