Patent Assignment Details
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| Reel/Frame: | 059912/0175 | |
| Pages: | 4 |
| | Recorded: | 05/16/2022 | | |
| Attorney Dkt #: | GBDJ052 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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17744779
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Filing Dt:
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05/16/2022
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Publication #:
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Pub Dt:
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02/23/2023
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Title:
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SOI LATERAL HOMOGENIZATION FIELD HIGH VOLTAGE POWER SEMICONDUCTOR DEVICE, MANUFACTURING METHOD AND APPLICATION THEREOF
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Assignee
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| NO.2006, XIYUAN AVE, WEST HI-TECH ZONE 611731 CHENGDU, SICHUAN, P.R.CHINA |
| CHENGDU, CHINA 611731 |
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Correspondence name and address
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GOKALP BAYRAMOGLU
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1540 WEST WARM SPRINGS RD., SUITE 100
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SUITE 100
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HENDERSON, NV 89014
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05/02/2024 05:00 AM
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