Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 059951/0644 | |
| Pages: | 5 |
| | Recorded: | 05/18/2022 | | |
| Attorney Dkt #: | ?38780.04032 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/30/2024
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Application #:
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17436307
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Filing Dt:
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09/03/2021
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Publication #:
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Pub Dt:
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06/09/2022
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Title:
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SiC SUBSTRATE MANUFACTURING METHOD AND MANUFACTURING DEVICE, AND METHOD FOR REDUCING WORK-AFFECTED LAYER IN SiC SUBSTRATE
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Assignees
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| 1-155, UEGAHARA-ICHIBAN-CHO |
| NISHINOMIYA-SHI |
| HYOGO, JAPAN 6628501 |
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| 9-8, MEIEKI 4-CHOME |
| NAKAMURA-KU |
| NAGOYA, JAPAN 4508575 |
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Correspondence name and address
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YIZHOU LIU
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CALFEE, HALTER & GRISWOLD LLP
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1405 EAST SIXTH STREET
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CLEVELAND, OH 44114-1607
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05/03/2024 05:35 PM
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