Patent Assignment Details
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Reel/Frame: | 059960/0883 | |
| Pages: | 4 |
| | Recorded: | 05/19/2022 | | |
Attorney Dkt #: | 00283.0047.00US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17644135
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Filing Dt:
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12/14/2021
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Publication #:
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Pub Dt:
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06/16/2022
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Title:
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WAFER BONDING METHOD AND BONDED WAFER
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Assignee
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18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE |
WUHAN, CHINA 430074 |
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Correspondence name and address
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ANOVA LAW GROUP, PLLC
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21495 RIDGETOP CIRCLE, SUITE 300
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STERLING, VA 20166
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05/20/2024 11:15 PM
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