Patent Assignment Details
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| Reel/Frame: | 059991/0264 | |
| Pages: | 4 |
| | Recorded: | 05/23/2022 | | |
| Attorney Dkt #: | 38780.04043 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17763142
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Filing Dt:
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03/23/2022
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Publication #:
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Pub Dt:
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11/10/2022
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Title:
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SIC SUBSTRATE, SIC SUBSTRATE PRODUCTION METHOD, SIC SEMICONDUCTOR DEVICE, AND SIC SEMICONDUCTOR DEVICE PRODUCTION METHOD
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Assignees
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| 1-155, UEGAHARA-ICHIBAN-CHO |
| NISHINOMIYA-SHI |
| HYOGO, JAPAN 6628501 |
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| 9-8, MEIEKI 4-CHOME |
| NAKAMURA-KU |
| NAGOYA, JAPAN 4508575 |
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Correspondence name and address
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YIZHOU LIU
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CALFEE, HALTER & GRISWOLD LLP
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1405 EAST SIXTH STREET
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CLEVELAND, OH 44144-1607
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