Patent Assignment Details
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| Reel/Frame: | 060016/0896 | |
| Pages: | 6 |
| | Recorded: | 05/25/2022 | | |
| Attorney Dkt #: | TTAP 12353 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17779801
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Filing Dt:
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05/25/2022
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Publication #:
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Pub Dt:
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12/22/2022
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Title:
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Magnetic-field melting solder, and joining method in which same is used
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Assignees
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| 23, SENJU-HASHIDO-CHO, |
| ADACHI-KU, TOKYO, JAPAN 1208555 |
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| 3-1, KASUMIGASEKI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 1008921 |
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Correspondence name and address
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BRIAN S. MYERS
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100 S. JEFFERSON ROAD
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SUITE 202
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WHIPPANY, NJ 07981
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04/29/2024 06:36 AM
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