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Reel/Frame:060027/0542   Pages: 7
Recorded: 05/26/2022
Attorney Dkt #:JP920210035(306-0312)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17804175
Filing Dt:
05/26/2022
Publication #:
Pub Dt:
01/12/2023
Title:
HEAT SINK, COOLING MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING HEAT SINK
Assignors
1
Exec Dt:
05/25/2022
2
Exec Dt:
05/23/2022
3
Exec Dt:
05/25/2022
Assignee
1
151 LORONG CHUAN
#02-01 NEW TECH PARK
SINGAPORE, SINGAPORE 556741
Correspondence name and address
SHIMOKAJI & ASSOCIATES, P.C.
22431 ANTONIO PARKWAY
SUITE B160-468
RANCHO SANTA MARGARI, CA 92688

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