Patent Assignment Details
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| Reel/Frame: | 060061/0531 | |
| Pages: | 2 |
| | Recorded: | 05/31/2022 | | |
| Attorney Dkt #: | P002 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17829252
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Filing Dt:
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05/31/2022
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Publication #:
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Pub Dt:
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12/21/2023
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Title:
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Package Assembly and Method of Attaching Multi-Height Dies/Modules to Multi-Chip Active/Passive Substrate
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Assignee
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| 1114 CLIFF VIEW DRIVE |
| SPICEWOOD, TEXAS 78669 |
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Correspondence name and address
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TERRILE, CANNATTI & CHAMBERS, LLP
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P.O. BOX 203518
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AUSTIN, TX 78720
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05/09/2024 08:59 PM
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