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Patent Assignment Details
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Reel/Frame:060067/0671   Pages: 4
Recorded: 06/01/2022
Attorney Dkt #:Q275280
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17825799
Filing Dt:
05/26/2022
Publication #:
Pub Dt:
07/13/2023
Title:
RESIN-SEALED SEMICONDUCTOR DEVICE
Assignor
1
Exec Dt:
04/19/2022
Assignee
1
7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN 1008310
Correspondence name and address
SUGHRUE
2000 PENNSYLVANIA AVENUE, NW
SUITE 900
WASHINGTON, DC 20006-1811

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