Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 060068/0139 | |
| Pages: | 4 |
| | Recorded: | 06/01/2022 | | |
| Attorney Dkt #: | 1390.0837C |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/19/2023
|
Application #:
|
17829619
|
Filing Dt:
|
06/01/2022
|
|
Publication #:
|
|
Pub Dt:
|
09/15/2022
| | | | |
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SEMICONDUCTOR PACKAGE
|
|
|
Assignees
|
|
|
|
|
| 889 HUIQING RD., PUDONG NEW DISTRICT |
| SHANGHAI, CHINA 201201 |
|
|
|
|
|
| 3388TH HUANING RD, MINHANG DISTRICT |
| SHANGHAI, CHINA 201108 |
|
|
Correspondence name and address
|
| |
KDB FIRM PLLC (BOIP)
|
| |
2601 WESTON PARKWAY
|
| |
SUITE 103
|
| |
CARY, 27513 UNITED STATES
|
Search Results as of:
05/17/2024 02:55 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
