Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060146/0430 | |
| Pages: | 12 |
| | Recorded: | 06/09/2022 | | |
| Attorney Dkt #: | TSMCP886USD |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/18/2023
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Application #:
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17836076
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Filing Dt:
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06/09/2022
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Publication #:
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Pub Dt:
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09/22/2022
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Title:
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THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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ESCHWEILER & POTASHNIK, LLC
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629 EUCLID AVE.
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SUITE 1101
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CLEVELAND, OH 44114
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05/15/2024 05:48 AM
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