Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 060237/0495 | |
| Pages: | 6 |
| | Recorded: | 06/17/2022 | | |
Attorney Dkt #: | WB-202205-004-1(0160US01) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17807485
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Filing Dt:
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06/17/2022
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Publication #:
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Pub Dt:
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12/21/2023
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Title:
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SEED LAYER FOR ENHANCING TUNNEL MAGNETORESISTANCE WITH PERPENDICULARLY MAGNETIZED HEUSLER FILMS
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Assignee
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129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI |
GYEONGGI-DO, KOREA, REPUBLIC OF 443-742 |
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Correspondence name and address
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IBM CORPORATION - PATENT CENTER
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1701 NORTH STREET
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B/256-3
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ENDICOTT, NY 13760
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