Patent Assignment Details
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| Reel/Frame: | 060269/0711 | |
| Pages: | 16 |
| | Recorded: | 06/03/2022 | | |
| Attorney Dkt #: | TSLC/SHINETSU2019-002.01C |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/02/2024
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Application #:
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17740729
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Filing Dt:
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05/10/2022
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Publication #:
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Pub Dt:
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08/25/2022
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Title:
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Method For Fabricating (LED) Dice Using Semiconductor Structures On A Substrate And Laser Lift-Off To A Receiving Plate
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Assignees
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| 1F, NO. 11, KE JUNG RD., CHU-NAN SITE |
| HSINCHU SCIENCE PARK |
| CHU-NAN, MIAO-LI COUNTY, TAIWAN 350 |
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| 20TH FLOOR, MARUNOUCHI EIRAKU BLDG., |
| 4-1, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-0005 |
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Correspondence name and address
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STEPHEN A. GRATTON
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2764 SOUTH BRAUN WAY
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LAKEWOOD, CO 80228
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05/08/2024 04:59 AM
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