Total properties:
51
|
|
Patent #:
|
|
Issue Dt:
|
08/06/2013
|
Application #:
|
12964049
|
Filing Dt:
|
12/09/2010
|
Publication #:
|
|
Pub Dt:
|
06/14/2012
| | | | |
Title:
|
HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2014
|
Application #:
|
13182890
|
Filing Dt:
|
07/14/2011
|
Publication #:
|
|
Pub Dt:
|
07/19/2012
| | | | |
Title:
|
HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/2013
|
Application #:
|
13462158
|
Filing Dt:
|
05/02/2012
|
Publication #:
|
|
Pub Dt:
|
11/08/2012
| | | | |
Title:
|
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/28/2015
|
Application #:
|
13792521
|
Filing Dt:
|
03/11/2013
|
Publication #:
|
|
Pub Dt:
|
08/08/2013
| | | | |
Title:
|
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/30/2016
|
Application #:
|
13954455
|
Filing Dt:
|
07/30/2013
|
Publication #:
|
|
Pub Dt:
|
11/28/2013
| | | | |
Title:
|
HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/17/2015
|
Application #:
|
14291672
|
Filing Dt:
|
05/30/2014
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2017
|
Application #:
|
14325547
|
Filing Dt:
|
07/08/2014
|
Publication #:
|
|
Pub Dt:
|
01/14/2016
| | | | |
Title:
|
SELECTIVE REMOVAL OF SEMICONDUCTOR FINS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/2015
|
Application #:
|
14564640
|
Filing Dt:
|
12/09/2014
|
Publication #:
|
|
Pub Dt:
|
04/02/2015
| | | | |
Title:
|
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/31/2017
|
Application #:
|
14578842
|
Filing Dt:
|
12/22/2014
|
Publication #:
|
|
Pub Dt:
|
10/22/2015
| | | | |
Title:
|
PUNCH THROUGH STOPPER IN BULK FINFET DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/23/2018
|
Application #:
|
14719829
|
Filing Dt:
|
05/22/2015
|
Publication #:
|
|
Pub Dt:
|
11/24/2016
| | | | |
Title:
|
STRUCTURE AND PROCESS TO TUCK FIN TIPS SELF-ALIGNED TO GATES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/22/2017
|
Application #:
|
14919451
|
Filing Dt:
|
10/21/2015
|
Publication #:
|
|
Pub Dt:
|
04/27/2017
| | | | |
Title:
|
Bulk Nanosheet with Dielectric Isolation
|
|
|
Patent #:
|
|
Issue Dt:
|
09/06/2016
|
Application #:
|
14934544
|
Filing Dt:
|
11/06/2015
|
Publication #:
|
|
Pub Dt:
|
03/17/2016
| | | | |
Title:
|
HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/28/2017
|
Application #:
|
14946245
|
Filing Dt:
|
11/19/2015
|
Title:
|
STABLE WORK FUNCTION FOR NARROW-PITCH DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2019
|
Application #:
|
14951333
|
Filing Dt:
|
11/24/2015
|
Publication #:
|
|
Pub Dt:
|
05/25/2017
| | | | |
Title:
|
MIDDLE-OF-LINE (MOL) CAPACITANCE REDUCTION FOR SELF-ALIGNED CONTACT IN GATE STACK
|
|
|
Patent #:
|
|
Issue Dt:
|
06/27/2017
|
Application #:
|
14979053
|
Filing Dt:
|
12/22/2015
|
Publication #:
|
|
Pub Dt:
|
07/21/2016
| | | | |
Title:
|
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/18/2018
|
Application #:
|
15198524
|
Filing Dt:
|
06/30/2016
|
Publication #:
|
|
Pub Dt:
|
10/27/2016
| | | | |
Title:
|
HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/16/2019
|
Application #:
|
15206127
|
Filing Dt:
|
07/08/2016
|
Publication #:
|
|
Pub Dt:
|
05/25/2017
| | | | |
Title:
|
SEMICONDUCTOR STRUCTURES INCLUDING MIDDLE-OF-LINE (MOL) CAPACITANCE REDUCTION FOR SELF-ALIGNED CONTACT IN GATE STACK
|
|
|
Patent #:
|
|
Issue Dt:
|
09/25/2018
|
Application #:
|
15250166
|
Filing Dt:
|
08/29/2016
|
Publication #:
|
|
Pub Dt:
|
12/15/2016
| | | | |
Title:
|
PUNCH THROUGH STOPPER IN BULK FINFET DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/16/2018
|
Application #:
|
15250207
|
Filing Dt:
|
08/29/2016
|
Publication #:
|
|
Pub Dt:
|
12/22/2016
| | | | |
Title:
|
PUNCH THROUGH STOPPER IN BULK FINFET DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/12/2019
|
Application #:
|
15251797
|
Filing Dt:
|
08/30/2016
|
Publication #:
|
|
Pub Dt:
|
03/01/2018
| | | | |
Title:
|
SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2018
|
Application #:
|
15284862
|
Filing Dt:
|
10/04/2016
|
Publication #:
|
|
Pub Dt:
|
04/05/2018
| | | | |
Title:
|
SELECTIVE GAS ETCHING FOR SELF-ALIGNED PATTERN TRANSFER
|
|
|
Patent #:
|
|
Issue Dt:
|
08/15/2017
|
Application #:
|
15339096
|
Filing Dt:
|
10/31/2016
|
Publication #:
|
|
Pub Dt:
|
05/25/2017
| | | | |
Title:
|
STABLE WORK FUNCTION FOR NARROW-PITCH DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/23/2017
|
Application #:
|
15339665
|
Filing Dt:
|
10/31/2016
|
Title:
|
STACKED TRANSISTORS WITH DIFFERENT CHANNEL WIDTHS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/23/2018
|
Application #:
|
15342477
|
Filing Dt:
|
11/03/2016
|
Publication #:
|
|
Pub Dt:
|
03/16/2017
| | | | |
Title:
|
PUNCH THROUGH STOPPER IN BULK FINFET DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/01/2019
|
Application #:
|
15417312
|
Filing Dt:
|
01/27/2017
|
Publication #:
|
|
Pub Dt:
|
08/02/2018
| | | | |
Title:
|
NANOSHEET FIELD EFFECT TRANSISTORS WITH PARTIAL INSIDE SPACERS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/04/2019
|
Application #:
|
15445112
|
Filing Dt:
|
02/28/2017
|
Publication #:
|
|
Pub Dt:
|
08/30/2018
| | | | |
Title:
|
ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
03/31/2020
|
Application #:
|
15450829
|
Filing Dt:
|
03/06/2017
|
Publication #:
|
|
Pub Dt:
|
06/22/2017
| | | | |
Title:
|
SELECTIVE REMOVAL OF SEMICONDUCTOR FINS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/16/2019
|
Application #:
|
15463155
|
Filing Dt:
|
03/20/2017
|
Publication #:
|
|
Pub Dt:
|
05/03/2018
| | | | |
Title:
|
STACKED TRANSISTORS WITH DIFFERENT CHANNEL WIDTHS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/06/2018
|
Application #:
|
15472745
|
Filing Dt:
|
03/29/2017
|
Title:
|
FORMING SELF-ALIGNED VIAS AND AIR-GAPS IN SEMICONDUCTOR FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
08/28/2018
|
Application #:
|
15628851
|
Filing Dt:
|
06/21/2017
|
Publication #:
|
|
Pub Dt:
|
10/05/2017
| | | | |
Title:
|
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/06/2019
|
Application #:
|
15642690
|
Filing Dt:
|
07/06/2017
|
Publication #:
|
|
Pub Dt:
|
10/26/2017
| | | | |
Title:
|
Bulk Nanosheet with Dielectric Isolation
|
|
|
Patent #:
|
|
Issue Dt:
|
06/04/2019
|
Application #:
|
15651420
|
Filing Dt:
|
07/17/2017
|
Publication #:
|
|
Pub Dt:
|
11/02/2017
| | | | |
Title:
|
Bulk Nanosheet with Dielectric Isolation
|
|
|
Patent #:
|
|
Issue Dt:
|
03/05/2019
|
Application #:
|
15656326
|
Filing Dt:
|
07/21/2017
|
Publication #:
|
|
Pub Dt:
|
11/09/2017
| | | | |
Title:
|
PUNCH THROUGH STOPPER IN BULK FINFET DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/01/2019
|
Application #:
|
15715593
|
Filing Dt:
|
09/26/2017
|
Publication #:
|
|
Pub Dt:
|
01/25/2018
| | | | |
Title:
|
PUNCH THROUGH STOPPER IN BULK FINFET DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/11/2020
|
Application #:
|
15797648
|
Filing Dt:
|
10/30/2017
|
Publication #:
|
|
Pub Dt:
|
08/02/2018
| | | | |
Title:
|
NANOSHEET FIELD EFFECT TRANSISTORS WITH PARTIAL INSIDE SPACERS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/10/2019
|
Application #:
|
15802634
|
Filing Dt:
|
11/03/2017
|
Publication #:
|
|
Pub Dt:
|
08/30/2018
| | | | |
Title:
|
ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
01/01/2019
|
Application #:
|
15813634
|
Filing Dt:
|
11/15/2017
|
Publication #:
|
|
Pub Dt:
|
03/22/2018
| | | | |
Title:
|
STABLE WORK FUNCTION FOR NARROW-PITCH DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/26/2019
|
Application #:
|
15815173
|
Filing Dt:
|
11/16/2017
|
Publication #:
|
|
Pub Dt:
|
10/04/2018
| | | | |
Title:
|
FORMING SELF-ALIGNED VIAS AND AIR-GAPS IN SEMICONDUCTOR FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
02/11/2020
|
Application #:
|
16001426
|
Filing Dt:
|
06/06/2018
|
Publication #:
|
|
Pub Dt:
|
10/04/2018
| | | | |
Title:
|
SELECTIVE GAS ETCHING FOR SELF-ALIGNED PATTERN TRANSFER
|
|
|
Patent #:
|
|
Issue Dt:
|
04/21/2020
|
Application #:
|
16056940
|
Filing Dt:
|
08/07/2018
|
Publication #:
|
|
Pub Dt:
|
12/06/2018
| | | | |
Title:
|
PUNCH THROUGH STOPPER IN BULK FINFET DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/17/2020
|
Application #:
|
16058425
|
Filing Dt:
|
08/08/2018
|
Publication #:
|
|
Pub Dt:
|
12/06/2018
| | | | |
Title:
|
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/2021
|
Application #:
|
16219225
|
Filing Dt:
|
12/13/2018
|
Publication #:
|
|
Pub Dt:
|
05/02/2019
| | | | |
Title:
|
High Density Three-dimensional Integrated Capacitors
|
|
|
Patent #:
|
|
Issue Dt:
|
09/01/2020
|
Application #:
|
16250561
|
Filing Dt:
|
01/17/2019
|
Publication #:
|
|
Pub Dt:
|
05/23/2019
| | | | |
Title:
|
SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
02/23/2021
|
Application #:
|
16257221
|
Filing Dt:
|
01/25/2019
|
Publication #:
|
|
Pub Dt:
|
06/06/2019
| | | | |
Title:
|
FORMING SELF-ALIGNED VIAS AND AIR-GAPS IN SEMICONDUCTOR FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
09/01/2020
|
Application #:
|
16261305
|
Filing Dt:
|
01/29/2019
|
Publication #:
|
|
Pub Dt:
|
05/23/2019
| | | | |
Title:
|
MIDDLE-OF-LINE (MOL) CAPACITANCE REDUCTION FOR SELF-ALIGNED CONTACT IN GATE STACK
|
|
|
Patent #:
|
|
Issue Dt:
|
03/02/2021
|
Application #:
|
16399845
|
Filing Dt:
|
04/30/2019
|
Publication #:
|
|
Pub Dt:
|
08/22/2019
| | | | |
Title:
|
SEMICONDUCTOR STRUCTURES INCLUDING MIDDLE-OF-LINE (MOL) CAPACITANCE REDUCTION FOR SELF-ALIGNED CONTACT IN GATE STACK
|
|
|
Patent #:
|
|
Issue Dt:
|
06/08/2021
|
Application #:
|
16508691
|
Filing Dt:
|
07/11/2019
|
Publication #:
|
|
Pub Dt:
|
10/31/2019
| | | | |
Title:
|
ALTERNATING HARDMASKS FOR TIGHT-PITCH LINE FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
02/23/2021
|
Application #:
|
16682588
|
Filing Dt:
|
11/13/2019
|
Publication #:
|
|
Pub Dt:
|
03/12/2020
| | | | |
Title:
|
SELECTIVE GAS ETCHING FOR SELF-ALIGNED PATTERN TRANSFER
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2022
|
Application #:
|
16684115
|
Filing Dt:
|
11/14/2019
|
Publication #:
|
|
Pub Dt:
|
03/26/2020
| | | | |
Title:
|
NANOSHEET FIELD EFFECT TRANSISTORS WITH PARTIAL INSIDE SPACERS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/10/2020
|
Application #:
|
16778899
|
Filing Dt:
|
01/31/2020
|
Publication #:
|
|
Pub Dt:
|
05/28/2020
| | | | |
Title:
|
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2022
|
Application #:
|
17181269
|
Filing Dt:
|
02/22/2021
|
Publication #:
|
|
Pub Dt:
|
06/17/2021
| | | | |
Title:
|
SELECTIVE GAS ETCHING FOR SELF-ALIGNED PATTERN TRANSFER
|
|