Patent Assignment Details
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Reel/Frame: | 060605/0789 | |
| Pages: | 3 |
| | Recorded: | 07/25/2022 | | |
Attorney Dkt #: | I2000.277.101 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17713857
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Filing Dt:
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04/05/2022
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Publication #:
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Pub Dt:
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11/10/2022
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Title:
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LEAD-FREE SOLDER MATERIAL, LAYER STRUCTURE, METHOD OF FORMING A SOLDER MATERIAL, AND METHOD OF FORMING A LAYER STRUCTURE
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Assignee
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AM CAMPEON 1-15 |
NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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DICKE, BILLIG & CZAJA
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FIFTH STREET TOWERS
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100 SOUTH FIFTH STREET, SUITE 2250
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MINNEAPOLIS, 55402 UNITED STATES
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