Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060605/0911 | |
| Pages: | 4 |
| | Recorded: | 07/25/2022 | | |
| Attorney Dkt #: | BC220026US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17872371
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Filing Dt:
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07/25/2022
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Publication #:
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Pub Dt:
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01/25/2024
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Title:
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PARTITIONED OVERLAPPED COPPER-BONDED INTERPOSERS
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Assignee
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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Correspondence name and address
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BROADCOM/SUITER SWANTZ PC LLO
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14301 FNB PARKWAY, SUITE 220
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OMAHA, NE 68154
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05/12/2024 02:40 AM
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