Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060689/0505 | |
| Pages: | 5 |
| | Recorded: | 08/01/2022 | | |
| Attorney Dkt #: | 220058US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17876189
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Filing Dt:
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07/28/2022
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Publication #:
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Pub Dt:
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02/01/2024
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Title:
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Elastomer Interconnection Substrate Layer
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Assignee
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| 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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Correspondence name and address
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ADSERO IP
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8210 SOUTHPARK TERRACE
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LITTLETON, CO 80120
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05/15/2024 08:17 AM
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