Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060726/0564 | |
| Pages: | 4 |
| | Recorded: | 08/05/2022 | | |
| Attorney Dkt #: | 107452-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/07/2023
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Application #:
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17881639
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Filing Dt:
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08/05/2022
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Publication #:
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Pub Dt:
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03/16/2023
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Title:
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TEMPERATURE COMPENSATION CIRCUIT AND SEMICONDUCTOR INTEGRATED CIRCUIT USING THE SAME
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Assignee
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| NO. 8 KEYA 1ST RD., DAYA DISTRICT, CENTRAL TAIWAN SCIENCE PARK, |
| TAICHUNG CITY, TAIWAN |
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Correspondence name and address
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JCIPRNET
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8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
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TAIPEI, 100404 TAIWAN
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