Patent Assignment Details
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| Reel/Frame: | 060768/0100 | |
| Pages: | 5 |
| | Recorded: | 08/10/2022 | | |
| Attorney Dkt #: | T5057-1460A |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17818782
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Filing Dt:
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08/10/2022
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Publication #:
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Pub Dt:
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12/01/2022
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Title:
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METHOD OF MAKING A SEMICONDUCTOR DEVICE HAVING A THERMAL CONTACT
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Assignees
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| 8, LI-HSING RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| 4000, WEN XIANG RD., SONGJIANG |
| SHANGHAI, CHINA |
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Correspondence name and address
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HAUPTMAN HAM, LLP
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2318 MILL ROAD, SUITE 1400
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ALEXANDRIA, VA 22314
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05/09/2024 08:47 AM
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