Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060801/0595 | |
| Pages: | 6 |
| | Recorded: | 08/14/2022 | | |
| Attorney Dkt #: | 172-ZP22714292US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/15/2023
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Application #:
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17887454
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Filing Dt:
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08/14/2022
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Publication #:
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Pub Dt:
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01/05/2023
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Title:
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DEVICE FOR CONVEYING AND DISPERSING SILICON WAFERS
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Assignee
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| RM.201, BLDG.1, NO.500 SHUNDA RD., YUHANG ECONOMIC |
| AND TECHNOLOGICAL DEVELOPMENT ZONE, LINPING DIST. |
| HANGZHOU, CHINA 311100 |
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Correspondence name and address
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CLIFFORD CHI, A.P.C.
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300 W VALLEY BLVD #609
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ALHAMBRA, CA 91803
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05/21/2024 02:45 PM
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