Patent Assignment Details
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| Reel/Frame: | 060859/0115 | |
| Pages: | 6 |
| | Recorded: | 08/22/2022 | | |
| Attorney Dkt #: | 1022.0103CON |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/02/2024
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Application #:
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17892423
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Filing Dt:
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08/22/2022
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Publication #:
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Pub Dt:
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12/22/2022
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Title:
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Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
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Assignee
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| 3-4, KANDAKAJI-CHO, CHIYODA-KU |
| TOKYO, JAPAN 1010045 |
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Correspondence name and address
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EDELL, SHAPIRO & FINNAN, LLC
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9801 WASHINGTONIAN BOULEVARD
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SUITE 750
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GAITHERSBURG, MD 20878
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05/11/2024 11:08 AM
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