Patent Assignment Details
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| Reel/Frame: | 060913/0649 | |
| Pages: | 3 |
| | Recorded: | 08/26/2022 | | |
| Attorney Dkt #: | 13210155US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/04/2022
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Application #:
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15922932
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Filing Dt:
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03/16/2018
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Publication #:
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Pub Dt:
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07/19/2018
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Title:
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CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATION METHOD
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Assignee
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| HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518129 |
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Correspondence name and address
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MAIER & MAIER, PLLC
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345 S. PATRICK ST
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ALEXANDRIA, VA 22314
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05/17/2024 11:44 AM
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