Patent Assignment Details
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Reel/Frame: | 060915/0207 | |
| Pages: | 7 |
| | Recorded: | 08/26/2022 | | |
Attorney Dkt #: | 210683-US-ORG1 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17896746
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Filing Dt:
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08/26/2022
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Publication #:
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Pub Dt:
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02/29/2024
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Title:
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PARTITIONING WAFER PROCESSING AND HYBRID BONDING OF LAYERS FORMED ON DIFFERENT WAFERS FOR A SEMICONDUCTOR ASSEMBLY
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Assignee
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2485 AUGUSTINE DRIVE |
SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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ADVANCED MICRO DEVICES, INC. C/O KLS
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797 SAM BASS ROAD #2559
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ROUND ROCK, 78681 UNITED STATES
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05/22/2024 03:43 AM
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