Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060944/0789 | |
| Pages: | 4 |
| | Recorded: | 08/31/2022 | | |
| Attorney Dkt #: | MEIGI-PIPM2PHD20220831 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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04/28/2015
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Application #:
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11713099
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Filing Dt:
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03/02/2007
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Publication #:
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Pub Dt:
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09/13/2007
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Title:
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Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
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Patent #:
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Issue Dt:
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03/17/2015
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Application #:
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12933064
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Filing Dt:
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09/16/2010
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Publication #:
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Pub Dt:
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01/20/2011
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Title:
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PACKAGE FOR OPTICAL SEMICONDUCTOR DEVICE, OPTICAL SEMICONDUCTOR DEVICE USING THE PACKAGE, AND METHODS FOR PRODUCING SAME
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Patent #:
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Issue Dt:
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05/01/2018
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Application #:
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14576105
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Filing Dt:
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12/18/2014
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Publication #:
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Pub Dt:
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04/16/2015
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Title:
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LEAD, WIRING MEMBER, PACKAGE PART, METAL PART PROVIDED WITH RESIN AND RESIN-SEALED SEMICONDUCTOR DEVICE, AND METHODS FOR PRODUCING SAME
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Patent #:
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Issue Dt:
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05/17/2022
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Application #:
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16853307
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Filing Dt:
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04/20/2020
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Publication #:
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Pub Dt:
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08/06/2020
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Title:
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OPTICAL SEMICONDUCTOR DEVICE PACKAGE, OPTICAL SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR OPTICAL SEMICONDUCTOR DEVICE PACKAGE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17178684
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Filing Dt:
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02/18/2021
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Publication #:
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Pub Dt:
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06/10/2021
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Title:
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PACKAGE FOR INSTALLING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
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Assignee
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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Correspondence name and address
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PASONA KNOWLEDGE PARTNER INC.
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1-61, SHIROMI 2-CHOME, CHUO-KU
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8F OBP PANASONIC TOWER
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OSAKA, 540-6208 JAPAN
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