Patent Assignment Details
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Reel/Frame: | 060950/0215 | |
| Pages: | 7 |
| | Recorded: | 08/31/2022 | | |
Attorney Dkt #: | C2725.10199US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17908118
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Filing Dt:
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08/30/2022
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Publication #:
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Pub Dt:
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03/23/2023
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Title:
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WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTED STRUCTURE AND FABRICATING METHOD THEREOF
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Assignees
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778 CHUANGXIN WEST ROAD, PILOT FREE TRADE ZONE |
PUDONGXIN DISTRICT |
SHANGHAI, CHINA 200131 |
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BUILDING D1,CHINA SENSOR NETWORK INTERNATIONAL |
INNOVATION PARK, 200 LINGHU BOULEVARD, XINWU DIST. |
WUXI, JIANGSU, CHINA 214135 |
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Correspondence name and address
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R. BURNS ISRAELSEN
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MASCHOFF BRENNAN
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111 S MAIN ST #600
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SALT LAKE CITY, UT 84111
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