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Reel/Frame:060981/0183   Pages: 4
Recorded: 09/02/2022
Attorney Dkt #:1012-3283 / 2021P00902 US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17840971
Filing Dt:
06/15/2022
Publication #:
Pub Dt:
12/29/2022
Title:
SEMICONDUCTOR MODULE WITH SHAPED EXTERNAL CONTACT FOR REDUCED CRACK FORMATION IN THE ENCAPSULATION BODY
Assignors
1
Exec Dt:
06/28/2022
2
Exec Dt:
06/29/2022
3
Exec Dt:
06/28/2022
4
Exec Dt:
06/28/2022
5
Exec Dt:
06/28/2022
Assignee
1
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondence name and address
MURPHY, BILAK & HOMILLER, PLLC/INFINEON
P.O. BOX 1959
CARY, NC 27512-1959

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