Patent Assignment Details
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| Reel/Frame: | 061063/0495 | |
| Pages: | 4 |
| | Recorded: | 09/12/2022 | | |
| Attorney Dkt #: | KIN-53306 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17942506
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Filing Dt:
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09/12/2022
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Publication #:
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Pub Dt:
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03/30/2023
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Title:
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SOLDER COMPOSITION AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
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Assignee
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| 1-19-43, HIGASHI-OIZUMI |
| NERIMA-KU |
| TOKYO, JAPAN 178-8511 |
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Correspondence name and address
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RANKIN HILL AND CLARK LLP
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38210 GLENN AVENUE
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WILLOUGHBY, OH 44094
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05/13/2024 02:14 AM
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