Patent Assignment Details
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Reel/Frame: | 061085/0579 | |
| Pages: | 2 |
| | Recorded: | 09/14/2022 | | |
Attorney Dkt #: | POL-13783 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17944248
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Filing Dt:
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09/14/2022
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Publication #:
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Pub Dt:
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03/23/2023
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Title:
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DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
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Assignee
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610-5, SHIMOIMASUWA, |
MINAMI-ALPS, YAMANASHI, JAPAN 400-0212 |
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Correspondence name and address
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MATTINGLY & MALUR, PC
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1800 DIAGONAL ROAD, SUITE 210
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ALEXANDRIA, VA 22314
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05/04/2024 08:29 AM
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