Patent Assignment Details
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| Reel/Frame: | 061257/0975 | |
| Pages: | 2 |
| | Recorded: | 09/29/2022 | | |
| Attorney Dkt #: | 1278.0007-7US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/06/2023
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Application #:
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17956239
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Filing Dt:
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09/29/2022
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Title:
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BUS PIPELINE STRUCTURE FOR DIE-TO-DIE INTERCONNECT AND CHIP
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Assignee
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| BUILDING C, NO. 888, HUANHU WEST 2ND ROAD |
| LINGANG NEW AREA |
| CHINA (SHANGHAI) PILOT FREE TRADE ZONE, CHINA 201306 |
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Correspondence name and address
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SUSAN RYAN
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129 W. EVESHAM ROAD
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VOORHEES, NJ 08043
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05/22/2024 06:51 AM
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