Patent Assignment Details
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Reel/Frame: | 061326/0026 | |
| Pages: | 4 |
| | Recorded: | 10/05/2022 | | |
Attorney Dkt #: | 891102.403 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17750239
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Filing Dt:
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05/20/2022
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Publication #:
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Pub Dt:
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05/11/2023
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Title:
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TRIM FREE WAFER BONDING METHODS AND DEVICES
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Assignee
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SEED IP LAW GROUP LLP
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701 5TH AVE
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SUITE 5400
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SEATTLE, WA 98104
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05/17/2024 10:17 PM
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