Patent Assignment Details
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| Reel/Frame: | 061328/0970 | |
| Pages: | 4 |
| | Recorded: | 10/06/2022 | | |
| Attorney Dkt #: | SE-US225637 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17960866
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Filing Dt:
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10/06/2022
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Publication #:
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Pub Dt:
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04/13/2023
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Title:
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BINDING MATERIAL AND METHOD FOR MANUFACTURING MOLDED BODY
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Assignee
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| 1-6, SHINJUKU 4-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN 160-8801 |
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Correspondence name and address
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GLOBAL IP COUNSELORS, LLP DAVID TARNOFF
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1233 20TH STREET, NW
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SUITE 600
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WASHINGTON, DC 20036-2680
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04/27/2024 05:02 PM
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