Patent Assignment Details
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| Reel/Frame: | 061349/0278 | |
| Pages: | 6 |
| | Recorded: | 10/07/2022 | | |
| Attorney Dkt #: | 0105059-000004 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/27/2024
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Application #:
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17962061
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Filing Dt:
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10/07/2022
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Publication #:
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Pub Dt:
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02/16/2023
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Title:
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CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYBRID BONDING METHOD FOR ELECTRONIC DEVICE
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Assignees
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| 2-5-1, KURIGI, ASAO-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 2158550 |
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| 2-1-1, KATAHIRA, AOBA-KU |
| SENDAI-SHI, MIYAGI, JAPAN 9808577 |
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Correspondence name and address
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BUCHANAN INGERSOLL & ROONEY PC
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1737 KING STREET, SUITE 500
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ALEXANDRIA, VA 22314
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04/29/2024 12:50 PM
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