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Total properties:
25
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Patent #:
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Issue Dt:
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08/22/2017
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Application #:
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14749529
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Filing Dt:
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06/24/2015
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Publication #:
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Pub Dt:
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12/29/2016
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Title:
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STRUCTURES AND METHODS FOR RELIABLE PACKAGES
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Patent #:
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Issue Dt:
|
01/05/2021
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Application #:
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15336192
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Filing Dt:
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10/27/2016
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Publication #:
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Pub Dt:
|
02/16/2017
| | | | |
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Title:
|
STRUCTURES AND METHODS FOR LOW TEMPERATURE BONDING USING
NANOPARTICLES
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Patent #:
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Issue Dt:
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02/26/2019
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Application #:
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15624494
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Filing Dt:
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06/15/2017
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Publication #:
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Pub Dt:
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12/20/2018
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Title:
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Multi-Chip Modules Formed Using Wafer-Level Processing of a Reconstitute Wafer
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Patent #:
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Issue Dt:
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01/14/2020
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Application #:
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15649457
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Filing Dt:
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07/13/2017
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Publication #:
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Pub Dt:
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10/26/2017
| | | | |
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Title:
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Structures and Methods for Reliable Packages
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|
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Patent #:
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Issue Dt:
|
04/21/2020
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Application #:
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15919570
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Filing Dt:
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03/13/2018
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Publication #:
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Pub Dt:
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03/21/2019
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Title:
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DIRECT-BONDED LED ARRAYS AND APPLICATIONS
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|
|
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Patent #:
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Issue Dt:
|
01/14/2020
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Application #:
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15937149
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Filing Dt:
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03/27/2018
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Publication #:
|
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Pub Dt:
|
08/02/2018
| | | | |
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Title:
|
STRUCTURES AND METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
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Patent #:
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Issue Dt:
|
09/03/2019
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Application #:
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15970055
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Filing Dt:
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05/03/2018
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|
Title:
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Dielets on Flexible and Stretchable Packaging for Microelectronics
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Patent #:
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|
Issue Dt:
|
10/15/2019
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Application #:
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15994435
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Filing Dt:
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05/31/2018
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Publication #:
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Pub Dt:
|
12/06/2018
| | | | |
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Title:
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Flat Metal Features for Microelectronics Applications
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|
|
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Patent #:
|
|
Issue Dt:
|
01/28/2020
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Application #:
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16246863
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Filing Dt:
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01/14/2019
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Publication #:
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Pub Dt:
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05/16/2019
| | | | |
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Title:
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MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONSTITUTED WAFER
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|
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Patent #:
|
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Issue Dt:
|
12/01/2020
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Application #:
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16369631
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Filing Dt:
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03/29/2019
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Publication #:
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Pub Dt:
|
10/01/2020
| | | | |
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Title:
|
DIFFUSED BITLINE REPLACEMENT IN STACKED WAFER MEMORY
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|
|
|
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Patent #:
|
|
Issue Dt:
|
06/07/2022
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Application #:
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16515417
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Filing Dt:
|
07/18/2019
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Publication #:
|
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Pub Dt:
|
11/07/2019
| | | | |
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Title:
|
DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/17/2020
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Application #:
|
16563512
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Filing Dt:
|
09/06/2019
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Publication #:
|
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Pub Dt:
|
12/26/2019
| | | | |
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Title:
|
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
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|
|
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Patent #:
|
|
Issue Dt:
|
01/02/2024
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Application #:
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16677213
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Filing Dt:
|
11/07/2019
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|
Publication #:
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Pub Dt:
|
05/13/2021
| | | | |
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Title:
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Scalable Architecture for Reduced Cycles Across SoC
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|
|
|
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Patent #:
|
|
Issue Dt:
|
07/06/2021
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Application #:
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16718820
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Filing Dt:
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12/18/2019
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Publication #:
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Pub Dt:
|
04/23/2020
| | | | |
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Title:
|
STRUCTURES AND METHODS FOR RELIABLE PACKAGES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
01/12/2021
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Application #:
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16740670
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Filing Dt:
|
01/13/2020
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|
Publication #:
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Pub Dt:
|
05/14/2020
| | | | |
|
Title:
|
Structures And Methods For Low Temperature Bonding Using Nanoparticles
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|
|
|
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Patent #:
|
|
Issue Dt:
|
05/10/2022
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Application #:
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16840245
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Filing Dt:
|
04/03/2020
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Publication #:
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Pub Dt:
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07/23/2020
| | | | |
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Title:
|
DIRECT-BONDED LED STRUCTURE CONTACTS AND SUBSTRATE CONTACTS
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|
|
|
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Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
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17070253
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Filing Dt:
|
10/14/2020
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|
Publication #:
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Pub Dt:
|
04/22/2021
| | | | |
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Title:
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Non-Volatile Dynamic Random Access Memory
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|
|
|
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Patent #:
|
|
Issue Dt:
|
03/01/2022
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Application #:
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17075489
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Filing Dt:
|
10/20/2020
|
|
Title:
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MIXED EXPOSURE FOR LARGE DIE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/20/2024
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Application #:
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17098128
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Filing Dt:
|
11/13/2020
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Publication #:
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Pub Dt:
|
03/18/2021
| | | | |
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Title:
|
FLAT METAL FEATURES FOR MICROELECTRONICS APPLICATIONS
|
|
|
|
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Patent #:
|
|
Issue Dt:
|
04/04/2023
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Application #:
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17107710
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Filing Dt:
|
11/30/2020
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Publication #:
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Pub Dt:
|
04/15/2021
| | | | |
|
Title:
|
DIFFUSED BITLINE REPLACEMENT IN STACKED WAFER MEMORY
|
|
|
|
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Patent #:
|
|
Issue Dt:
|
01/16/2024
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Application #:
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17122149
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Filing Dt:
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12/15/2020
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Publication #:
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Pub Dt:
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06/24/2021
| | | | |
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Title:
|
Apparatus For Non-Volatile Random Access Memory Stacks
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|
|
|
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Patent #:
|
|
Issue Dt:
|
07/25/2023
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Application #:
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17140519
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Filing Dt:
|
01/04/2021
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|
Publication #:
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Pub Dt:
|
07/22/2021
| | | | |
|
Title:
|
Structures And Methods For Low Temperature Bonding Using Nanoparticles
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/01/2023
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Application #:
|
17327169
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Filing Dt:
|
05/21/2021
|
|
Publication #:
|
|
Pub Dt:
|
09/16/2021
| | | | |
|
Title:
|
DIRECT-BONDED LED ARRAYS INCLUDING OPTICAL ELEMENTS CONFIGURED TO TRANSMIT OPTICAL SIGNALS FROM LED ELEMENTS
|
|
|
|
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Patent #:
|
|
Issue Dt:
|
03/12/2024
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Application #:
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17579259
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Filing Dt:
|
01/19/2022
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|
Publication #:
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Pub Dt:
|
07/07/2022
| | | | |
|
Title:
|
MIXED EXPOSURE FOR LARGE DIE
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17749442
|
Filing Dt:
|
05/20/2022
|
|
Publication #:
|
|
Pub Dt:
|
09/01/2022
| | | | |
|
Title:
|
DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
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|
