Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 061362/0441 | |
| Pages: | 7 |
| | Recorded: | 08/31/2022 | | |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
7
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Patent #:
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Issue Dt:
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04/06/2010
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Application #:
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10542419
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Filing Dt:
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12/29/2005
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Publication #:
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Pub Dt:
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05/18/2006
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Title:
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MULTILAYERED LEAD FRAME FOR A SEMICONDUCTOR LIGHT-EMITTING DEVICE
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Patent #:
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Issue Dt:
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08/09/2011
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Application #:
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12509065
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Filing Dt:
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07/24/2009
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Publication #:
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Pub Dt:
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11/19/2009
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Title:
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MULTILAYERED LEAD FRAME FOR A SEMICONDUCTOR LIGHT-EMITTING DEVICE
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Patent #:
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Issue Dt:
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09/24/2013
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Application #:
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12716938
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Filing Dt:
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03/03/2010
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Publication #:
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Pub Dt:
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06/24/2010
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Title:
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MULTILAYERED LEAD FRAME FOR A SEMICONDUCTOR LIGHT-EMITTING DEVICE
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Patent #:
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Issue Dt:
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02/07/2012
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Application #:
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13023906
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Filing Dt:
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02/09/2011
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Publication #:
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Pub Dt:
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09/15/2011
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Title:
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LEAD FRAME FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OF THE SAME
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Patent #:
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Issue Dt:
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01/24/2012
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Application #:
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13024582
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Filing Dt:
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02/10/2011
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Publication #:
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Pub Dt:
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09/15/2011
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Title:
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OPTICAL SEMICONDUCTOR PACKAGE AND OPTICAL SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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02/03/2015
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Application #:
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13062408
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Filing Dt:
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03/04/2011
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Publication #:
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Pub Dt:
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07/14/2011
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Title:
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LEAD, WIRING MEMBER, PACKAGE PART, METAL PART PROVIDED WITH RESIN AND RESIN-SEALED SEMICONDUCTOR DEVICE, AND METHODS FOR PRODUCING SAME
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Patent #:
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Issue Dt:
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05/13/2014
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Application #:
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13063446
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Filing Dt:
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03/10/2011
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Publication #:
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Pub Dt:
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07/07/2011
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Title:
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LEAD, WIRING MEMBER, PACKAGE COMPONENT, METAL COMPONENT WITH RESIN, RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE, AND METHODS FOR PRODUCING THE SAME
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Assignee
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN 571-8501 |
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Correspondence name and address
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PASONA KNOWLEDGE PARTNER INC.
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1-61, SHIROMI 2-CHOME, CHUO-KU
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8F OBP PANASONIC TOWER
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OSAKA, 540-6208 JAPAN
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