Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 061436/0160 | |
| Pages: | 2 |
| | Recorded: | 10/17/2022 | | |
| Attorney Dkt #: | YB019-05US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17693358
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Filing Dt:
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03/12/2022
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Publication #:
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Pub Dt:
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09/15/2022
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Title:
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SEMICONDUCTOR PACKAGING STRUCTURE, METHOD, DEVICE AND ELECTRONIC PRODUCT
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Assignee
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| 5045 WAI QING SONG RD., QINGPU DISTRICT |
| #20, AREA A, RM. 510 |
| SHANGHAI, CHINA 201700 |
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Correspondence name and address
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JAMIE J. ZHENG
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3790 EL CAMINO REAL #1147
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PALO ALTO, CA 94306
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05/11/2024 01:39 AM
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