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Patent Assignment Details
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Reel/Frame:061453/0141   Pages: 7
Recorded: 10/18/2022
Attorney Dkt #:22SD-018
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18047348
Filing Dt:
10/18/2022
Publication #:
Pub Dt:
04/27/2023
Title:
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
Assignor
1
Exec Dt:
10/04/2022
Assignee
1
80, OSHIMADA-MACHI, NAGANO-SHI,
NAGANO, JAPAN 381-2287
Correspondence name and address
IPUSA, P.L.L.C
1054 31ST STREET, N.W.
SUITE 400
WASHINGTON, DC 20007

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